Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC MPU SITARA 800MHZ 324NFBGA
|
Package: 324-LFBGA |
Stock7,616 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 324-LFBGA | 324-NFBGA(15x15) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
Package: 783-BBGA, FCBGA |
Stock5,472 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Package: 561-FBGA |
Stock3,440 |
|
2 Core, 32-Bit | 667MHz | - | DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU MPC83XX 266MHZ 473MAPBGA
|
Package: 473-LFBGA |
Stock7,232 |
|
1 Core, 32-Bit | 266MHz | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 473-LFBGA | 473-MAPBGA (19x19) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 1023FCBGA
|
Package: 1023-BBGA, FCBGA |
Stock4,000 |
|
1 Core, 32-Bit | 1.0GHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 1023-BBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
Package: 689-BBGA Exposed Pad |
Stock5,872 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (4) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 333MHZ 516BGA
|
Package: 516-BBGA Exposed Pad |
Stock5,104 |
|
1 Core, 32-Bit | 333MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 333MHZ 516BGA
|
Package: 516-BBGA |
Stock2,320 |
|
1 Core, 32-Bit | 333MHz | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 672TBGA
|
Package: 672-LBGA |
Stock7,952 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU M683XX 33MHZ 357BGA
|
Package: 357-BBGA |
Stock4,384 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
Package: 357-BBGA |
Stock6,192 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU M683XX 33MHZ 241PGA
|
Package: 241-BEPGA |
Stock6,496 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 241-BEPGA | 241-PGA (47.24x47.24) |
||
NXP |
IC MPU MPC74XX 450MHZ 360FCCLGA
|
Package: 360-CLGA, FCCLGA |
Stock3,120 |
|
1 Core, 32-Bit | 450MHz | - | - | No | - | - | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 360-CLGA, FCCLGA | 360-FCCLGA (25x25) |
||
Zilog |
IC MPU Z180 20MHZ 100QFP
|
Package: 100-QFP |
Stock7,424 |
|
1 Core, 8-Bit | 20MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 100-QFP | 100-QFP |
||
Advantech Corp |
CORE2 QUAD DT 2.6G 13F 6M
|
Package: - |
Stock3,568 |
|
4 Core, 64-Bit | 2.66GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU Q OR IQ 1.333GHZ 1295BGA
|
Package: 1295-BBGA, FCBGA |
Stock7,216 |
|
4 Core, 32-Bit | 1.333GHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 1295FCBGA
|
Package: 1295-BBGA, FCBGA |
Stock5,952 |
|
4 Core, 32-Bit | 1.2GHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.5GHZ 783FCBGA
|
Package: 783-BBGA, FCBGA |
Stock5,472 |
|
1 Core, 32-Bit | 1.5GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
|
Package: 784-BBGA, FCBGA |
Stock2,448 |
|
1 Core, 32-Bit | 667MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1), 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
Package: 256-BBGA |
Stock15,000 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
Package: 516-BBGA |
Stock7,376 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Package: 529-FBGA |
Stock2,288 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 529-FBGA | 529-TEPBGA-2 (19x19) |
||
NXP |
IC MPU I.MX21 266MHZ 289MAPBGA
|
Package: 289-LFBGA |
Stock12,336 |
|
1 Core, 32-Bit | 266MHz | - | SDRAM | No | Keypad, LCD | - | - | USB 1.x (2) | 1.8V, 3.0V | -40°C ~ 85°C (TA) | - | 289-LFBGA | - |
||
NXP |
IC MPU I.MX21 266MHZ 289MAPBGA
|
Package: 289-LFBGA |
Stock35,004 |
|
1 Core, 32-Bit | 266MHz | - | SDRAM | No | Keypad, LCD | - | - | USB 1.x (2) | 1.8V, 3.0V | 0°C ~ 70°C (TA) | - | 289-LFBGA | - |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
Package: 256-BBGA |
Stock21,792 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
Zilog |
IC MPU ZIP 20MHZ 100VQFP
|
Package: 100-LQFP |
Stock3,488 |
|
1 Core, 8-Bit | 20MHz | - | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 105°C (TA) | - | 100-LQFP | 100-VQFP (14x14) |
||
NXP |
QORIQ 64B POWER ARCH8X 1.8GHZ
|
Package: - |
Stock6,688 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 64B POWERARCH8X 1.8GHZ T
|
Package: - |
Stock6,848 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX6D ROM PERF ENHAN
|
Package: 624-FBGA, FCBGA |
Stock6,544 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC I.MX 7ULP VFBGA 361
|
Package: - |
Stock2,736 |
|
1 Core, 32-Bit | 720MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3 | Yes | MIPI-DSI | - | - | USB 2.0 (2) | - | 0°C ~ 95°C | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | - | - |