Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP 176-LBGA
|
Package: 176-LBGA |
Stock6,032 |
|
ADPCM | 4 | - | - | 400mW | -40°C ~ 85°C | Surface Mount | 176-LBGA | PG-LBGA-176 |
||
Infineon Technologies |
IC SHDSL TRANSCEIVER BGA-388
|
Package: 388-BBGA |
Stock7,248 |
|
HDLC, SHDSL, TDM | 4 | - | - | - | - | Surface Mount | 388-BBGA | 388-BGA (35x35) |
||
Microsemi Corporation |
IC ECHO CANCEL DUAL CODEC 81CBGA
|
Package: 81-LBGA |
Stock6,048 |
|
Serial | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 81-LBGA | 81-CABGA (10x10) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock4,576 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Inphi Corporation |
IC ETH MAC 24-PORT 1152UBGA
|
Package: 1152-BGA |
Stock5,568 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1152-BGA | 1152-UPBGA |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA
|
Package: 484-BGA |
Stock3,088 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Cypress Semiconductor Corp |
IC RECEIVER HOTLINK 256LBGA
|
Package: 256-LBGA Exposed Pad |
Stock4,352 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 640mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC SLIC 16CH 256CSBGA
|
Package: 256-LBGA, CSBGA |
Stock9,804 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
Package: 38-VFQFN Exposed Pad |
Stock2,176 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Maxim Integrated |
IC LIU E1/T1/J1 4X 5V LONG144BGA
|
Package: 144-BGA, CSPBGA |
Stock7,184 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-CSBGA (17x17) |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 24-DIP
|
Package: 24-DIP (0.300", 7.62mm) |
Stock6,704 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 2CH 225BG
|
Package: 225-BGA |
Stock2,800 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
IXYS Integrated Circuits Division |
IC MOD DAA FULL-WAVE LOOP PCB
|
Package: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Stock5,280 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Microsemi Corporation |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
Package: 32-LCC (J-Lead) |
Stock16,128 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Linear Technology |
IC RING TONE GENERATOR 14-DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock2,000 |
|
- | 1 | - | - | - | -40°C ~ 125°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock4,096 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 3V 24SSOP
|
Package: 24-SSOP (0.209", 5.30mm Width) |
Stock5,680 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Silicon Labs |
IC VOICE DAA SYSTEM SIDE 24QFN
|
Package: 24-WFQFN Exposed Pad |
Stock6,320 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (4x4) |
||
Microsemi Corporation |
ARROW-2X192
|
Package: 1292-BGA, FCBGA |
Stock6,704 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Renesas Electronics America |
IC RSLIC FAMILY 28PLCC
|
Package: 28-LCC (J-Lead) |
Stock7,920 |
|
2-Wire | 1 | 5V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC ETHERNET PHY QUAD 138QFN
|
Package: - |
Stock5,360 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 138-QFN (12x12) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Package: - |
Stock7,632 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Package: - |
Stock3,184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA
|
Package: 324-BGA |
Stock4,304 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DGTL SWITCH 4K X 2K 220BGA
|
Package: 220-BGA |
Stock3,712 |
|
- | 1 | 3V ~ 3.6V | 480mA | - | -40°C ~ 85°C | Surface Mount | 220-BGA | 220-BGA (17x17) |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
Package: - |
Stock5,184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
Package: 208-LBGA |
Stock2,272 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
Package: 81-LFBGA |
Stock4,176 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 81-LFBGA | 81-CABGA (9x9) |
||
Microchip Technology |
IC TXRX DTMF 24SSOP
|
Package: 24-SSOP (0.209", 5.30mm Width) |
Stock2,112 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC TDM SWITCH 512CH FLEX 160LQFP
|
Package: 160-LQFP |
Stock4,288 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 160-LQFP | 160-LQFP (24x24) |