Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC FLASH 32MBIT 104MHZ 24TFBGA
|
Package: 24-TBGA |
Stock6,208 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Winbond Electronics |
IC FLASH 128MBIT 104MHZ 24TFBGA
|
Package: 24-TBGA |
Stock3,840 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 3.4MHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,896 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | I2C | 3.4MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 256MBIT 80MHZ 8WSON
|
Package: 8-WDFN Exposed Pad |
Stock5,040 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Fremont Micro Devices USA |
IC EEPROM 2KBIT 2MHZ 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,696 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
IDT, Integrated Device Technology Inc |
IC SARAM 64KBIT 20NS 84PGA
|
Package: 84-BPGA |
Stock5,408 |
|
RAM | SARAM | 64Kb (4K x 16) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 84-BPGA | 84-PGA (27.94x27.94) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 100MHZ 50TSOP
|
Package: 50-TSOP (0.400", 10.16mm Width) |
Stock6,448 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 100MHz | - | 7ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 64KBIT 25NS 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock6,016 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
Cypress Semiconductor Corp |
IC SRAM 1.152MBIT 25NS 100TQFP
|
Package: 100-LQFP |
Stock2,768 |
|
SRAM | SRAM - Dual Port, Asynchronous | 1.152Mb (128K x 9) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
STMicroelectronics |
IC FLASH 1MBIT 90NS 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock60,000 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock5,808 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 55NS 100TQFP
|
Package: 100-LQFP |
Stock2,048 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 55ns | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 20NS 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock5,088 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 1.33GHZ 96BGA
|
Package: 96-TFBGA |
Stock4,464 |
|
DRAM | SDRAM - DDR4 | 4Gb (256M x 16) | Parallel | 1.33GHz | - | - | 1.14 V ~ 1.26 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (14x9) |
||
Cypress Semiconductor Corp |
IC SRAM 8MBIT 45NS 48VFBGA
|
Package: 48-VFBGA |
Stock7,344 |
|
SRAM | SRAM - Asynchronous | 8Mb (512K x 16) | Parallel | - | 45ns | 45ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Winbond Electronics |
IC FLASH 256MBIT 16SOIC
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock2,944 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Macronix |
IC FLASH 8MBIT 90NS 44SOP
|
Package: 44-SOIC (0.496", 12.60mm Width) |
Stock6,096 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-SOIC (0.496", 12.60mm Width) | 44-SOP |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
Package: 32-LCC (J-Lead) |
Stock4,400 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Winbond Electronics |
IC FLASH 32MBIT 133MHZ 16SOP
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock5,472 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock7,936 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,120 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock1,546,956 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5,616 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 300MHZ 165FBGA
|
Package: 165-LBGA |
Stock6,768 |
|
SRAM | SRAM - Synchronous, DDR II | 36Mb (2M x 18) | Parallel | 300MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Cypress Semiconductor Corp |
IC FLASH 256M 133MHZ 24BGA
|
Package: 24-TBGA |
Stock7,200 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Microchip Technology |
IC EEPROM 128K SPI 10MHZ WAFER
|
Package: Die |
Stock7,712 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
AKM Semiconductor Inc. |
INTEGRATED CIRCUIT
|
Package: - |
Stock14,316 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256G PARALLEL 267MHZ
|
Package: - |
Stock3,968 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 267MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC DRAM 32G 2133MHZ FBGA
|
Package: - |
Stock3,904 |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gb (1G x 32) | - | 2133MHz | - | - | 1.1V | -40°C ~ 105°C (TA) | - | - | - |
||
Maxim Integrated |
IC POWER MANAGEMENT
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,496 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 10ms | - | 1.62V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-µMAX |