Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Adesto Technologies |
IC FLASH 32MBIT 66MHZ 24CBGA
|
Package: 24-TBGA, CSPBGA |
Stock3,488 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 66MHz | 6ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 24-TBGA, CSPBGA | 24-CBGA (8x6) |
||
Texas Instruments |
IC NVSRAM 256KBIT 70NS 28DIP
|
Package: 28-DIP Module (0.61", 15.49mm) |
Stock2,336 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP Module (0.61", 15.49mm) | 28-DIP Module (18.42x37.72) |
||
Sharp Microelectronics |
IC SRAM 64KBIT 100NS 28SOP
|
Package: 28-SOP |
Stock3,488 |
|
SRAM | SRAM | 64Kb (8K x 8) | Parallel | - | 100ns | 100ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SOP | 28-SOP |
||
Sharp Microelectronics |
IC FLASH 128MBIT 75NS 56TSOP
|
Package: 56-TFSOP (0.724", 18.40mm Width) |
Stock6,688 |
|
FLASH | FLASH | 128Mb (16M x 8) | Parallel | - | 75ns | 75ns | 2.7 V ~ 3.3 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Microchip Technology |
IC FLASH 16MBIT 15MHZ 28TSOP
|
Package: 28-TSSOP (0.465", 11.80mm Width) |
Stock3,296 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 15MHz | 15ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC OTP 512KBIT 55NS 28DIP
|
Package: 28-DIP (0.600", 15.24mm) |
Stock3,904 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock4,800 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 25NS 100TQFP
|
Package: 100-LQFP |
Stock4,352 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 25NS 80TQFP
|
Package: 80-LQFP |
Stock3,696 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (8K x 9) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 133MHZ 90BGA
|
Package: 90-TFBGA |
Stock5,424 |
|
DRAM | SDRAM - Mobile | 256Mb (8M x 32) | Parallel | 133MHz | - | 6ns | 2.3 V ~ 3 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Micron Technology Inc. |
IC FLASH 256MBIT 108MHZ 8VPDFN
|
Package: 8-VDFN Exposed Pad |
Stock4,224 |
|
FLASH | FLASH - NOR | 256Mb (64M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFPN (MLP8) (8x6) |
||
ON Semiconductor |
IC EEPROM 1MBIT 10MHZ 8SOIC
|
Package: 8-SOIC (0.209", 5.30mm Width) |
Stock2,384 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 256MBIT 104MHZ 8WSON
|
Package: 8-WDFN Exposed Pad |
Stock3,888 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Cypress Semiconductor Corp |
NOR
|
Package: - |
Stock4,432 |
|
FLASH | FLASH - NOR | 16Mb (512K x 32) | Parallel | 56MHz | 60ns | 54ns | 1.65 V ~ 2.75 V | -40°C ~ 125°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 8KBIT 4MHZ M2J
|
Package: M2 J, Smart Card Module (TWI) |
Stock3,456 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
||
Microchip Technology |
IC EEPROM 1KBIT 3MHZ 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,376 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock104,196 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 36MBIT 133MHZ 256CABGA
|
Package: 256-BGA |
Stock5,680 |
|
SRAM | SRAM - Dual Port, Synchronous | 36Mb (1M x 36) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 256-BGA | 256-CABGA (17x17) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 45NS 32TSOP
|
Package: 32-SOIC (0.400", 10.16mm Width) |
Stock94,164 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 8MBIT 45NS 44TSOP
|
Package: 44-TSOP (0.400", 10.16mm Width) |
Stock20,232 |
|
SRAM | SRAM - Asynchronous | 8Mb (1M x 8) | Parallel | - | 45ns | 45ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC FRAM 2MBIT 40MHZ 8TDFN
|
Package: 8-WDFN Exposed Pad |
Stock18,996 |
|
FRAM | FRAM (Ferroelectric RAM) | 2Mb (256K x 8) | SPI | 40MHz | - | - | 2 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-TDFN (5x6) |
||
STMicroelectronics |
IC EEPROM 1MBIT 1MHZ 8SO
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock1,532,652 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 500ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Alliance Memory, Inc. |
IC SRAM 16M PARALLEL 48TSOP I
|
Package: 48-TFSOP (0.724", 18.40mm Width) |
Stock6,720 |
|
SRAM | SRAM | 16Mb (1M x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 64BGA
|
Package: 64-LBGA |
Stock5,024 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 60ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Cypress Semiconductor Corp |
IC FLASH 32M PARALLEL 48TSOP
|
Package: 48-TFSOP (0.724", 18.40mm Width) |
Stock4,480 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC DRAM 48G 2133MHZ FBGA
|
Package: - |
Stock5,696 |
|
DRAM | SDRAM - Mobile LPDDR4 | 48Gb (768M x 64) | - | 2133MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC DRAM 16G 1600MHZ FBGA
|
Package: - |
Stock3,952 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (256M x 64) | - | 1600MHz | - | - | 1.1V | -30°C ~ 105°C (TC) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 36K PARALLEL 80TQFP
|
Package: 80-LQFP |
Stock3,440 |
|
SRAM | SRAM - Dual Port, Synchronous | 36Kb (4K x 9) | Parallel | - | - | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 4G PARALLEL
|
Package: - |
Stock5,856 |
|
FLASH | FLASH - NAND | 4Gb (256M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | - | - | - |
||
Renesas Electronics America |
IC SRAM 2MBIT 70NS 44TSOP
|
Package: 44-TSOP (0.400", 10.16mm Width) |
Stock5,136 |
|
SRAM | SRAM | 2Mb (128K x 16) | Parallel | - | 70ns | 70ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |