Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,712 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock3,968 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
Package: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6,608 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 4GHZ 16MLF
|
Package: 16-VFQFN Exposed Pad, 16-MLF? |
Stock2,368 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock4,432 |
|
1 | 1:9 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock4,032 |
|
1 | 1:9 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 150MHZ 6SOT23
|
Package: SOT-23-6 |
Stock45,504 |
|
1 | 1:3 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC CLK BUFFER 1:3 40MHZ
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,192 |
|
1 | 1:3 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock2,704 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock22,296 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,776 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER
|
Package: 16-VFQFN Exposed Pad |
Stock5,648 |
|
1 | 2:2 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER
|
Package: 16-VFQFN Exposed Pad |
Stock4,912 |
|
1 | 2:2 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock2,384 |
|
1 | 1:2 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock2,864 |
|
1 | 1:2 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:2 150MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock5,424 |
|
1 | 1:2 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock2,944 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 16WQFN
|
Package: 16-VFQFN |
Stock6,720 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,848 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock6,816 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
Package: - |
Stock4,352 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 150MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock3,792 |
|
1 | 1:2 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock4,352 |
|
1 | 1:9 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:10 2GHZ 64TQFP
|
Package: 64-TQFP Exposed Pad |
Stock35,700 |
|
2 | 2:10 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:4 5.5GHZ 16MLF
|
Package: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6,304 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
Package: 32-TQFP |
Stock53,400 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16TSSOP
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock14,736 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOP
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock4,928 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
HIGH SPEED TRANSLATOR BUFFER TO
|
Package: 16-VFQFN |
Stock10,680 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
Package: 64-TQFP Exposed Pad |
Stock49,620 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |