NXP Products

BZX84-B4V3/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 4.3V
• Tolerance: ±2%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Package: TO-236-3, SC-59, SOT-23-3

NUR460/L02,112

NXP

DIODE GEN PURP 600V 4A DO201AD

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 600V
• Current - Average Rectified (Io): 4A
• Voltage - Forward (Vf) (Max) @ If: 1.28V @ 4A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 65ns
• Current - Reverse Leakage @ Vr: 50µA @ 600V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-201AD, Axial
• Supplier Device Package: DO-201AD
• Operating Temperature - Junction: 150°C (Max)

Package: DO-201AD, Axial

1PS301/ZLX

NXP

DIODE ARRAY GEN PURP 80V SOT323

• Diode Configuration: 1 Pair Common Cathode
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 80V
• Current - Average Rectified (Io) (per Diode): 250mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Operating Temperature - Junction: 150°C (Max)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

Package: SC-70, SOT-323

MC44BS373CAFC

NXP

IC MODULATOR AUD/VID U/V 20-QFN

• Type: NTSC/PAL Modulator
• Applications: Audio/Video, VCR's, Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-QFN-EP (5x5)

Package: 20-VQFN Exposed Pad

74HCT238N,652

NXP

IC DECODER/DEMUX 3-8 LINE 16-DIP

• Type: Decoder/Demultiplexer
• Circuit: 1 x 3:8
• Independent Circuits: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Package: 16-DIP (0.300", 7.62mm)

74LV373D,112

NXP

IC OCTAL D TRANSP LATCH 20SOIC

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 1 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 20ns
• Current - Output High, Low: 16mA, 16mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

Package: 20-SOIC (0.295", 7.50mm Width)

74ABT620N,602

NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

Package: 20-DIP (0.300", 7.62mm)

TDA9889TS/V1,518

NXP

IC AGC AMPLIFIER 16SSOP

• Applications: Automatic Gain Control (AGC)
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 55mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

Package: 16-SSOP (0.209", 5.30mm Width)

SC28L91A1A,529

NXP

IC UART SINGLE W/FIFO 44-PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Package: 44-LCC (J-Lead)

MC33689DPEW

NXP

IC SYSTEM BASIS W/LIN 32SOIC

• Applications: Automotive Mirror Control
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Mounting Type: Surface Mount

Package: 32-SOIC (0.295", 7.50mm Width)

PCA9671D,118

NXP

IC I/O EXPANDER I2C 16B 24SOIC

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: No
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

Package: 24-SOIC (0.295", 7.50mm Width)

MC145574ADWR2

NXP

IC TRANSCEIVER ISDN 28-SOIC

• Type: Transceiver
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

MPC8358ECVVAGDGA

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

Package: 740-LBGA

MPC8247CVRMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

Package: 516-BBGA

MC9S08QG84CPBE

NXP

IC MCU 8BIT 8KB FLASH 16DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Package: 16-DIP (0.300", 7.62mm)

MC908GR48ACFUE

NXP

IC MCU 8BIT 48KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 53
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

Package: 64-QFP

MC68HC908RF2MFA

NXP

IC MCU 8BIT 2KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, RF Mod
• Number of I/O: 12
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Package: 32-LQFP

MC9S12XDT256MAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

ADC1210S125HN/C1:5

NXP

ADC 12BIT SPI 125MSPS 40HVQFN

• Number of Bits: 12
• Sampling Rate (Per Second): 125M
• Number of Inputs: 1
• Input Type: Differential, Single Ended
• Data Interface: LVDS - Parallel, Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: External, Internal
• Voltage - Supply, Analog: 2.85 V ~ 3.4 V
• Voltage - Supply, Digital: 2.85 V ~ 3.4 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)
• Mounting Type: -

Package: 40-VFQFN Exposed Pad

TDA8784HL/C4,151

NXP

IC ADC 10BIT 18MSPS 48-LQFP

• Type: ADC
• Number of Channels: -
• Resolution (Bits): 10 b
• Sampling Rate (Per Second): 18M
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -20°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Package: 48-LQFP

MPC97H73FA

NXP

IC PLL CLK GENERATOR 1:12 52LQFP

• Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
• PLL: Yes with Bypass
• Input: LVCMOS, LVPECL
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 3:12
• Differential - Input:Output: Yes/No
• Frequency - Max: 240MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

Package: 52-LQFP

TFF1024HN/N1,115

NXP

IC CLOCK 2.15MHZ 1CIR 16DHVQFN

• PLL: Yes
• Main Purpose: Ku band VSAT applications
• Input: Clock, Crystal
• Output: Clock
• Number of Circuits: 1
• Ratio - Input:Output: 2:1
• Differential - Input:Output: No/No
• Frequency - Max: 2.15MHz
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-DHVQFN (2.5x3.5)

Package: 16-VFQFN Exposed Pad

MMA6821ALKGCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

MF1SPLUS6001DA4/02

NXP

IC SMART CARD 2KB EEPROM MOA4

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: PLLMC

Package: MOA4, Smart Card Module

BGU7064,518

NXP

IC AMP VGA LOW NOISE 16HLQFN

• Frequency: -
• P1dB: -
• Gain: -
• Noise Figure: -
• RF Type: -
• Voltage - Supply: -
• Current - Supply: -
• Test Frequency: -
• Package / Case: -
• Supplier Device Package: -

Package: -

MC32PF1550A2EP

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

Package: 40-VFQFN Exposed Pad

SAF7755HN/N208ZK

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

MCIMX535DVV1C2

NXP

I.MX53 32-BIT MPU ARM CORTEX-A8

• Core Processor: ARM® Cortex®-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (2)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-FBGA (19x19)

Package: 529-FBGA

SPC5746BSK1AMKU2

NXP

SINGLE CORE 3M FLASH 384K RAM

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: 129
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

Package: 176-LQFP Exposed Pad

LPC54S016JET100E

NXP

IC MCU 32BIT ROMLESS

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 360K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

Package: 100-TFBGA