NXP Products

BUK7514-60E,127

NXP

MOSFET N-CH 60V 58A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 60V
• Current - Continuous Drain (Id) @ 25°C: 58A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 22.9nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 1730pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 96W (Tc)
• Rds On (Max) @ Id, Vgs: 13 mOhm @ 15A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

Package: TO-220-3

MRFE6VP8600HSR5

NXP

FET RF 2CH 130V 860MHZ NI1230S

• Transistor Type: LDMOS (Dual)
• Frequency: 860MHz
• Gain: 19.3dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 125W
• Voltage - Rated: 130V
• Package / Case: NI-1230S
• Supplier Device Package: NI-1230S

Package: NI-1230S

MRF1K50GNR5

NXP

WIDEBAND RF POWER LDMOS TRANSIST

• Transistor Type: LDMOS
• Frequency: 1.8MHz ~ 500MHz
• Gain: 23dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: 1500W
• Voltage - Rated: 50V
• Package / Case: OM-1230G-4L
• Supplier Device Package: OM-1230G-4L

Package: OM-1230G-4L

BAP51-06W,115

NXP

DIODE PIN GP 50V 50MA SOT323

• Diode Type: PIN - 1 Pair Common Anode
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
• Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
• Power Dissipation (Max): 240mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

Package: SC-70, SOT-323

BYD37M,115

NXP

DIODE AVALANCHE 1KV 600MA MELF

• Diode Type: Avalanche
• Voltage - DC Reverse (Vr) (Max): 1000V
• Current - Average Rectified (Io): 600mA
• Voltage - Forward (Vf) (Max) @ If: 1.3V @ 1A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 300ns
• Current - Reverse Leakage @ Vr: 1µA @ 1000V
• Capacitance @ Vr, F: 20pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SOD-87
• Supplier Device Package: MELF
• Operating Temperature - Junction: -65°C ~ 175°C

Package: SOD-87

TDA3664AT/N1/N,118

NXP

IC REG LINEAR 5V 100MA 8SO

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 45V
• Voltage - Output (Min/Fixed): 5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.3V @ 50mA
• Current - Output: 100mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 30µA ~ 2.5mA
• PSRR: 60dB (120Hz)
• Control Features: -
• Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Package: 8-SOIC (0.154", 3.90mm Width)

MC34982PNAR2

NXP

IC SW HI SIDE SELF-PROT 16-PQFN

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 27 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 2 mOhm (Max)
• Input Type: -
• Features: Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 16-PowerDFN
• Supplier Device Package: 16-PQFN (12x12)

Package: 16-PowerDFN

NX5P3201CUKZ

NXP

IC USB SWITCH HI SD 3A 30WLCSP

• Switch Type: USB Switch
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: Parallel
• Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 3A, 6A
• Rds On (Typ): 8 mOhm, 32 mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled, Status Flag
• Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 30-UFBGA, WLCSP
• Supplier Device Package: 30-WLCSP (2.26x2.56)

Package: 30-UFBGA, WLCSP

MC33186DH2R2

NXP

IC MOTOR DRIVER PAR 20HSOP

• Output Configuration: Half Bridge (2)
• Applications: DC Motors, General Purpose, Solenoids
• Interface: Logic
• Load Type: Inductive
• Technology: Bi-CMOS
• Rds On (Typ): 150 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: -
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Features: Status Flag
• Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

HEF4014BP,652

NXP

IC STATIC SHIFT REG 8BIT 16DIP

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Parallel or Serial to Serial
• Voltage - Supply: 3 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Package: 16-DIP (0.300", 7.62mm)

74LV259D,112

NXP

IC 8BIT ADDRESSABLE LATCH 16SOIC

• Logic Type: D-Type, Addressable
• Circuit: 1:8
• Output Type: Standard
• Voltage - Supply: 1 V ~ 3.6 V
• Independent Circuits: 1
• Delay Time - Propagation: 36ns
• Current - Output High, Low: 6mA, 6mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Package: 16-SOIC (0.154", 3.90mm Width)

74LVT574DB,118

NXP

IC D-TYPE POS TRG SNGL 20SSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)

Package: 20-SSOP (0.209", 5.30mm Width)

TDF8530TH/N2,112

NXP

IC AMP AUDIO CLASS D 44HSOP

• Type: Class D
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 100W x 4 @ 2 Ohm
• Voltage - Supply: 6 V ~ 24 V
• Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 44-HSOP
• Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

Package: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

PCA9514ADP,118

NXP

IC ACCELERATR I2C HOTSWAP 8TSSOP

• Type: Buffer, Accelerator
• Applications: I2C - Hotswap
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 1.9pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 3.5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MC34CM0902WEFR2

NXP

IC TXRX CAN 14SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 2/2
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

P4080NXN1MMB

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 8 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (8), 10 Gbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

Package: 1295-BBGA, FCBGA

MPC860DTZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

Package: 357-BBGA

KMPC8560PXAQFB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Package: 784-BBGA, FCBGA

MC68360EM25L

NXP

IC MPU M683XX 25MHZ 240FQFP

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-FQFP (32x32)

Package: 240-BFQFP

P5010NSE7QMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

Package: 1295-BBGA, FCBGA

BSC9132NXE7MNMB

NXP

IC MPU Q OR IQ 1.333GHZ 780FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator
• Package / Case: 780-BFBGA, FCBGA
• Supplier Device Package: 780-FCBGA (23x23)

Package: 780-BFBGA, FCBGA

MCF51JM64EVLD

NXP

IC MCU 32BIT 64KB FLASH 44LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

Package: 44-LQFP

LPC1114LVFHN24/303

NXP

IC MCU 32BIT 32KB FLASH 24HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 20
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

Package: 24-VFQFN Exposed Pad

S9S08LG16J0CLH

NXP

IC MCU 8BIT 18KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 18KB (18K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.9K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Package: 64-LQFP

BGU8052,118

NXP

IC AMP LNA 5V 1900MHZ 8HWSON

• Frequency: 1.5GHz ~ 2.5GHz
• P1dB: 18dBm
• Gain: 18.5dB
• Noise Figure: 0.5dB
• RF Type: GSM, LTE, W-CDMA
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 48mA
• Test Frequency: 1.9GHz
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-HWSON (2x2)

Package: 8-WFDFN Exposed Pad

MCZ33905DS3EK

NXP

SYSTEM BASIS CHIP LIN 2X 3.3 V

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

Package: -

MMPF0200F6AEP

NXP

POWER MANAGEMENT IC I.MX6 PRE-

• Applications: -
• Voltage - Input: -
• Number of Outputs: -
• Voltage - Output: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

MCIMX6X3EVK10ABR

NXP

I.MX 6 SERIES 32-BIT MPU ARM CO

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (14x14)

Package: 400-LFBGA

MIMXRT1064DVL6A

NXP

I.MXRT1064 MPU 196MAPBGA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (10x10)

Package: 196-LFBGA

S912XDT384J1VAL

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP