NXP Products

PMBF4391,215

NXP

JFET N-CH 40V 250MW SOT23

• FET Type: N-Channel
• Voltage - Breakdown (V(BR)GSS): 40V
• Drain to Source Voltage (Vdss): 40V
• Current - Drain (Idss) @ Vds (Vgs=0): 50mA @ 20V
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: 4V @ 1nA
• Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
• Resistance - RDS(On): 30 Ohm
• Power - Max: 250mW
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23 (TO-236AB)

Package: TO-236-3, SC-59, SOT-23-3

MRF7S38040HSR3

NXP

FET RF 65V 3.6GHZ NI-400S

• Transistor Type: LDMOS
• Frequency: 3.4GHz ~ 3.6GHz
• Gain: 14dB
• Voltage - Test: 30V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 8W
• Voltage - Rated: 65V
• Package / Case: NI-400S-240
• Supplier Device Package: NI-400S-240

Package: NI-400S-240

BF1100R,215

NXP

MOSFET N-CH 14V 30MA SOT143

• Transistor Type: N-Channel Dual Gate
• Frequency: 800MHz
• Gain: -
• Voltage - Test: 9V
• Current Rating: 30mA
• Noise Figure: 2dB
• Current - Test: 10mA
• Power - Output: -
• Voltage - Rated: 14V
• Package / Case: SOT-143R
• Supplier Device Package: SOT-143R

Package: SOT-143R

BC640,126

NXP

TRANS PNP 80V 1A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1A
• Voltage - Collector Emitter Breakdown (Max): 80V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
• Power - Max: 830mW
• Frequency - Transition: 145MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

BFT25,215

NXP

TRANS RF NPN 5V 2.3GHZ SOT23-3

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 5V
• Frequency - Transition: 2.3GHz
• Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
• Gain: -
• Power - Max: 30mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
• Current - Collector (Ic) (Max): 6.5mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Package: TO-236-3, SC-59, SOT-23-3

SSL5236TE/1Y

NXP

IC LED DRIVER DIMMABLE 8HSO

• Type: AC DC Offline Switcher
• Topology: Step-Down (Buck), Step-Up (Boost)
• Internal Switch(s): Yes
• Number of Outputs: 1
• Voltage - Supply (Min): 9.9V
• Voltage - Supply (Max): 16V
• Voltage - Output: -
• Current - Output / Channel: 450mA
• Frequency: -
• Dimming: Triac
• Applications: -
• Operating Temperature: -40°C ~ 160°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
• Supplier Device Package: 8-HSO

Package: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

NTB0104BQ-Q100X

NXP

IC TXRX TRANSLATING 4B 14DHVQFN

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 4
• Voltage - VCCA: 1.2V ~ 3.6V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 100Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 14-VFQFN Exposed Pad
• Supplier Device Package: 14-DHVQFN (2.5x3)

Package: 14-VFQFN Exposed Pad

CBTU4411EE,557

NXP

IC BUS SWITCH 11-BIT 72-LFBGA

• Type: Bus Switch
• Circuit: 11 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 72-LFBGA
• Supplier Device Package: 72-LFBGA (7x7)

Package: 72-LFBGA

74HCT540N,652

NXP

IC INVERTER 8-INPUT 20DIP

• Logic Type: Buffer, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

Package: 20-DIP (0.300", 7.62mm)

74HC243N,652

NXP

IC BUS TXRX TRI-ST 4BIT 14DIP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

Package: 14-DIP (0.300", 7.62mm)

TDF8597TH/N1,118

NXP

IC AUDIO AMP BTL DUAL D 36HSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 150W x 1 @ 1 Ohm; 100W x 2 @ 2 Ohm
• Voltage - Supply: 6 V ~ 24 V
• Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 36-HSOP
• Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

UJA1078ATW/5V0/1J

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

• Applications: Automotive
• Interface: CAN, LIN
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

KMPC8378VRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

Package: 689-BBGA Exposed Pad

MC68MH360ZP33LR2

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

Package: 357-BGA

KMPC8347ZQAGD

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

Package: 620-BBGA Exposed Pad

MCF52223CVM66J

NXP

IC MCU 32BIT 256KB FLASH 81BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: I2C, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 81-LBGA
• Supplier Device Package: 81-MAPBGA (10x10)

Package: 81-LBGA

MC9S12HZ64CAA

NXP

IC MCU 16BIT 64KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

Package: 80-QFP

MC9S12UF32PBE

NXP

IC MCU 16BIT 32KB FLASH 64LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 30MHz
• Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
• Peripherals: POR, WDT
• Number of I/O: 41
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Package: 64-LQFP

P89V660FA,512

NXP

IC MCU 8BIT 16KB FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Package: 44-LCC (J-Lead)

MPC564CZP66

NXP

IC MCU 32BIT 512KB FLASH 388BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

Package: 388-BBGA

MCF51JM32VQH

NXP

IC MCU 32BIT 32KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

Package: 64-QFP

MC56F8355MFGE

NXP

IC MCU 16BIT 256KB FLASH 128LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number of I/O: 49
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 10K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x20)

Package: 128-LQFP

MK10DN128VFM5

NXP

IC MCU 32BIT 128KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 10x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

Package: 32-VFQFN Exposed Pad

S9KEAZ128AMLK

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 71
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

Package: 80-LQFP

MMA6801KWR2

NXP

ACCELEROMETER 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

Package: 16-QFN Exposed Pad

SA606DK,118

NXP

IC MIXER 150MHZ UP CONVRT 20SSOP

• RF Type: Cellular, ASK, FSK
• Frequency: 150MHz
• Number of Mixers: 2
• Gain: 17dB
• Noise Figure: 6.2dB
• Secondary Attributes: Up Converter
• Current - Supply: 4.2mA
• Voltage - Supply: 2.7 V ~ 7 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

Package: 20-LSSOP (0.173", 4.40mm Width)

BGU7007,115

NXP

IC MMIC LNA FOR GNSS 6-XSON

• Frequency: 1575.42MHz
• P1dB: -12dBm
• Gain: 18.5dB
• Noise Figure: 0.85dB
• RF Type: GPS/GNSS
• Voltage - Supply: 1.5 V ~ 2.85 V
• Current - Supply: 12.8mA
• Test Frequency: 1.559GHz ~ 1.61GHz
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

Package: 6-XFDFN

BGA2870,115

NXP

IC MMIC AMPLIFIER 6TSSOP

• Frequency: 0Hz ~ 750MHz
• P1dB: 4dBm
• Gain: 31dB
• Noise Figure: 3.7dB
• RF Type: General Purpose
• Voltage - Supply: 2.3 V ~ 2.7 V
• Current - Supply: 16mA
• Test Frequency: 2.15GHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

Package: 6-TSSOP, SC-88, SOT-363

S9S12GN48ACLH

NXP

S12 CORE48K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Package: 64-LQFP

S9S08SG32E1VTJR

NXP

8-BIT MCU S08 CORE 32KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)