NXP Products

MRF7S21210HSR5

NXP

FET RF 65V 2.17GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 18.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 63W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

Package: NI-780S

MRF19090SR3

NXP

FET RF 65V 1.93GHZ NI-880S

• Transistor Type: LDMOS
• Frequency: 1.93GHz
• Gain: 11.5dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 750mA
• Power - Output: 90W
• Voltage - Rated: 65V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

Package: NI-880S

A2T21H140-24SR3

NXP

RF FET 2.1GHZ 140W NI780S-4L2L

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

Package: -

BUK9Y3R0-40E/GFX

NXP

MOSFET N-CH LFPAK

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

BZX84-C3V3/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 3.3V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 95 Ohms
• Current - Reverse Leakage @ Vr: 5µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Package: TO-236-3, SC-59, SOT-23-3

SL2FCS5301EV/DH,11

NXP

IC I-CODE SLI FCP2

• Type: -
• Applications: Factory/Home Automation
• Mounting Type: Surface Mount
• Package / Case: 2-FlipChip
• Supplier Device Package: FCP2

Package: 2-FlipChip

SSTU32865ET/G,518

NXP

IC REG BUFFER 28BIT 160-TFBGA

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

Package: 160-TFBGA

74AVC16835ADGV,112

NXP

IC RGSTRD DVR 3-ST 18BIT 56TVSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 18
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 56-TSSOP

Package: 56-TFSOP (0.173", 4.40mm Width)

TDA20143/2,557

NXP

IC HDMI INTERFACE 28-HVQFN

• Type: Tuner
• Applications: Set-Top Boxes, TV
• Mounting Type: Surface Mount
• Package / Case: 28-VFQFN Exposed Pad
• Supplier Device Package: 28-HVQFN (5x5)

Package: 28-VFQFN Exposed Pad

MC33389CDW

NXP

IC SYSTEM BASE W/CAN 28-SOIC

• Applications: Automotive
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC
• Mounting Type: Surface Mount

Package: 28-SOIC (0.295", 7.50mm Width)

PCA9554ABS3,118

NXP

IC I/O EXPANDER I2C 8B 16HVQFN

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (3x3)

Package: 16-VFQFN Exposed Pad

TJA1054T/N1,512

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

Package: 14-SOIC (0.154", 3.90mm Width)

MCIMX257CVM4

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: LPDDR, DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, Touchscreen
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

Package: 400-LFBGA

MCIMX6Q4AVT10ACR

NXP

IC MPU I.MX6Q 1.0GHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

Package: 624-FBGA, FCBGA

MC68L11D0CFBE2

NXP

IC MCU 8BIT ROMLESS 44QFP

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 26
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

Package: 44-QFP

MC56F8002VWL

NXP

IC MCU 16BIT 12KB FLASH 28SOIC

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 12KB (6K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 16
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 15x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

MC56F82726VLFR

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3K x 16
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Package: 48-LQFP

S9S12ZVL32F0VLF

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Package: 48-LQFP

MCF51AC128ACFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

Package: 64-QFP

MC912D60ACFUE8

NXP

IC MCU 16BIT 60KB FLASH 80QFP

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: CAN, MI Bus, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

Package: 80-QFP

MFRC52302HN1,157

NXP

IC READER 32-HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.5 V ~ 3.3 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

Package: 32-VFQFN Exposed Pad

PCF7941XTT/C2AB370

NXP

IC REMOTE KEYLESS ENTRY 20TSSOP

• Frequency: -
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -

Package: -

JN5168DB/01Z

NXP

DEMO BOARD JN5168

• Type: -
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: -

Package: -

MW5IC970NBR1

NXP

IC PWR AMP RF 28V 70W TO-272-16

• Frequency: 800MHz ~ 900MHz
• P1dB: -
• Gain: 30dB
• Noise Figure: -
• RF Type: General Purpose
• Voltage - Supply: 28V
• Current - Supply: 80mA
• Test Frequency: -
• Package / Case: TO-272-16 Variant, Flat Leads
• Supplier Device Package: TO-272 WB-16

Package: TO-272-16 Variant, Flat Leads

MCIMX7S5EVK08SD

NXP

I.MX 7SOLO: REV 1.3

• Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, MIPI
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
• Package / Case: 488-TFBGA
• Supplier Device Package: 488-FBGA (12x12)

Package: 488-TFBGA

SPC5745BFK1AVMH2

NXP

SINGLE CORE 2M FLASH 256K RAM

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

Package: 100-LBGA

SPC5744PK1AMLQ5

NXP

2.5MB NVM 2 X E200Z4 CORES 150

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 79
• Program Memory Size: 2.5MB (2.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Package: 144-LQFP

S912XEQ512F1MALR

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

S912ZVM16F1MKF

NXP

S12Z CORE16K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: SCI
• Peripherals: DMA, POR, WDT
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

Package: 48-LQFP Exposed Pad

TEA1999TK/2J

NXP

IC CTRLR SYNC RECT HVSON8

• Applications: Active/Synchronous Rectification Controller
• Voltage - Input: -
• Voltage - Supply: 0V ~ 21V
• Current - Supply: 250µA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

Package: 8-VDFN Exposed Pad