NXP Products

BC337-25,112

NXP

TRANS NPN 45V 0.5A TO92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
• Power - Max: 625mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

Package: TO-226-3, TO-92-3 (TO-226AA)

BZX84-C5V6/CH/LFVL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 5.6V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 1µA @ 2V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Package: TO-236-3, SC-59, SOT-23-3

UBA2014T/N1,518

NXP

IC CNTL BALLAST 600V 16-SOIC

• Type: Ballast Controller
• Frequency: 40.5kHz ~ 100kHz
• Voltage - Supply: 9.1 V ~ 13 V
• Current - Supply: 1.5mA
• Current - Output Source/Sink: -
• Dimming: No
• Operating Temperature: -25°C ~ 80°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Package: 16-SOIC (0.154", 3.90mm Width)

74ABT16841ADL,518

NXP

IC 20BIT BUS INTFC LATCH 56SSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 10:10
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 2
• Delay Time - Propagation: 2.2ns
• Current - Output High, Low: 32mA, 64mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

Package: 56-BSSOP (0.295", 7.50mm Width)

74ABT20N,112

NXP

IC GATE NAND 2CH 4-INP 14-DIP

• Logic Type: NAND Gate
• Number of Circuits: 2
• Number of Inputs: 4
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 50µA
• Current - Output High, Low: 15mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 3.9ns @ 5V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

Package: 14-DIP (0.300", 7.62mm)

TDA10027HN/C1,551

NXP

IC DEMOD DUAL W/RX 64-HVQFN

• Type: Demodulator
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Dual Rows Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

Package: 64-VFQFN Dual Rows Exposed Pad

P82B96TD,118

NXP

IC REDRIVER I2C 2CH 400KHZ 8SO

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 2
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 7pF
• Voltage - Supply: 2 V ~ 15 V
• Current - Supply: 900µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Package: 8-SOIC (0.154", 3.90mm Width)

NX3L1T66GM,115

NXP

IC ANALOG SWITCH SPST XSON6

• Switch Circuit: SPST - NO
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): -
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 28ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

Package: 6-XFDFN

PPC8306SCVMABDCA

NXP

IC MPU MPC83XX 133MHZ 369BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 369-LFBGA
• Supplier Device Package: 369-PBGA (19x19)

Package: 369-LFBGA

MPC8358ZQADDDA

NXP

IC MPU MPC83XX 266MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

Package: 668-BBGA Exposed Pad

MPC850CVR66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

Package: 256-BBGA

MC9328MXLDVM20R2

NXP

IC MPU I.MXL 200MHZ 256MAPBGA

• Core Processor: ARM920T
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: -30°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 256-LFBGA
• Supplier Device Package: -

Package: 256-LFBGA

KMPC8560PXAQFB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Package: 784-BBGA, FCBGA

MC7447AVS1420LB

NXP

IC MPU MPC74XX 1.42GHZ 360FCCLGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.42GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CLGA, FCCLGA
• Supplier Device Package: 360-FCCLGA (25x25)

Package: 360-CLGA, FCCLGA

MC9S12KT256MPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

MC9S12UF32PBE

NXP

IC MCU 16BIT 32KB FLASH 64LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 30MHz
• Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
• Peripherals: POR, WDT
• Number of I/O: 41
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Package: 64-LQFP

S912XEP100J5CVL

NXP

IC MCU 16BIT 1MB FLASH 208MAPBGA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 152
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

Package: 208-BGA

LPC43S20FBD144E

NXP

IC MCU 32BIT ROMLESS 144LQFP

• Core Processor: ARM? Cortex?-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 204MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 83
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Package: 144-LQFP

MCF5206EAB54

NXP

IC MCU 32BIT ROMLESS 160QFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 54MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 8
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 160-BQFP
• Supplier Device Package: 160-QFP (28x28)

Package: 160-BQFP

MC9S08LL16CLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Package: 48-LQFP

MPC9351AC

NXP

IC PLL CLOCK DRIVER LV 32-LQFP

• Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
• PLL: Yes with Bypass
• Input: LVCMOS, LVPECL
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 2:9
• Differential - Input:Output: Yes/No
• Frequency - Max: 200MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Package: 32-LQFP

KTY83/150,153

NXP

IC TEMPERATURE SENSOR DO-34

• Resistance in Ohms @ 25°C: 1k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 175°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: DO-204AG, DO-34, Axial
• Supplier Device Package: DO-34

Package: DO-204AG, DO-34, Axial

MPX2100D

NXP

SENSOR DIFF PRESS 14.5PSI MAX

• Pressure Type: Differential
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

Package: 4-SIP Module

SX5101P5T1

NXP

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

OM7692/BFU690F,598

NXP

EVAL BOARD FOR BFU690F

• Type: Amplifier
• Frequency: 2.33GHz
• For Use With/Related Products: BFU690F
• Supplied Contents: Board

Package: -

MC32PF1510A7EPR2

NXP

PF1510

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

Package: 40-VFQFN Exposed Pad

MKW36A512VFP4

NXP

KINETIS W 32-BIT MCU ARM CORTEX-

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: 40-QFN
• Supplier Device Package: -

Package: 40-QFN

SAF775DHN-N208W-AK

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

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TJA1028BT-0Z

NXP

IC TRANSCEIVER HALF 1/1 8SO

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: 20kBaud
• Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Package: -

74LVC1G34GF000

NXP

BUFFER, LVC/LCX/Z SERIES

• Logic Type: -
• Number of Elements: -
• Number of Bits per Element: -
• Input Type: -
• Output Type: -
• Current - Output High, Low: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

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