Page 69 - Xilinx Inc. Products | Heisener Electronics
Contact Us
SalesDept@heisener.com +86-755-83210559-836
Language Translation

* Please refer to the English Version as our Official Version.

Xilinx Inc. Products

Records 7,167
Page  69/239
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
XC17V01PC20I
Xilinx Inc.

IC PROM SER 1MBIT 3.3V 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
Package: 20-LCC (J-Lead)
Stock6,640
XCZU17EG-3FFVC1760E
Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
Package: 1760-BBGA, FCBGA
Stock7,536
XCZU5EV-L2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
Package: 784-BBGA, FCBGA
Stock4,016
XCZU3EG-L1SFVA625I
Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
Package: 625-BFBGA, FCBGA
Stock4,624
hot XC2S100E-6FT256C
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 182
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock11,268
hot XCV50-6PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 166
  • Number of Gates: 57906
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
Package: 240-BFQFP
Stock4,240
XC4036XL-3HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 193
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
Package: 240-BFQFP Exposed Pad
Stock2,336
XC4036XL-09HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 256
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
Package: 304-BFQFP Exposed Pad
Stock4,544
XC4020XL-3BG256C
Xilinx Inc.

IC FPGA 205 I/O 256BGA

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 205
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
Package: 256-BBGA
Stock5,952
hot XC4020E-1HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 193
  • Number of Gates: 20000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
Package: 240-BFQFP Exposed Pad
Stock10,704
XC4013XL-2BG256I
Xilinx Inc.

IC FPGA 192 I/O 256BGA

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 192
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
Package: 256-BBGA
Stock3,664
XC4008E-4PG191I
Xilinx Inc.

IC FPGA 144 I/O 191CPGA

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 770
  • Total RAM Bits: 10368
  • Number of I/O: 144
  • Number of Gates: 8000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 191-BCPGA
  • Supplier Device Package: 191-CPGA (47.25x47.25)
Package: 191-BCPGA
Stock3,968
XC4005XL-2PQ160C
Xilinx Inc.

IC FPGA 112 I/O 160QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
Package: 160-BQFP
Stock7,856
XQ6VSX475T-L1RF1156I
Xilinx Inc.

IC FPGA VIRTEX 6 476K 1156-BGA

  • Number of LABs/CLBs: 37200
  • Number of Logic Elements/Cells: 476160
  • Total RAM Bits: 39223296
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
Package: 1156-BBGA, FCBGA
Stock3,536
XC4VFX100-10FF1517C
Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

  • Number of LABs/CLBs: 10544
  • Number of Logic Elements/Cells: 94896
  • Total RAM Bits: 6930432
  • Number of I/O: 768
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
Package: 1517-BBGA, FCBGA
Stock2,784
XCKU3P-1FFVB676I
Xilinx Inc.

XCKU3P-1FFVB676I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 26828800
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Package: -
Stock4,848
XC5VSX35T-2FFG665C
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 2720
  • Number of Logic Elements/Cells: 34816
  • Total RAM Bits: 3096576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
Package: 665-BBGA, FCBGA
Stock4,816
hot XC6SLX150T-2FGG900C
Xilinx Inc.

IC FPGA 540 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 540
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
Package: 900-BBGA
Stock15,144
XC6SLX150-N3FGG900I
Xilinx Inc.

IC FPGA 576 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
Package: 900-BBGA
Stock5,136
XC2VP2-5FGG456I
Xilinx Inc.

IC FPGA 156 I/O 456FGBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
Package: 456-BBGA
Stock3,008
XA3S700A-4FGG400Q
Xilinx Inc.

IC FPGA 311 I/O 400FBGA

  • Number of LABs/CLBs: 1472
  • Number of Logic Elements/Cells: 13248
  • Total RAM Bits: 368640
  • Number of I/O: 311
  • Number of Gates: 700000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
Package: 400-BGA
Stock5,520
XC7A50T-L2FTG256E
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock6,272
XC6SLX9-3FTG256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock5,424
XC6SLX9-N3FTG256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock3,152
hot XC3S100E-4CPG132I
Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

  • Number of LABs/CLBs: 240
  • Number of Logic Elements/Cells: 2160
  • Total RAM Bits: 73728
  • Number of I/O: 83
  • Number of Gates: 100000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
Package: 132-TFBGA, CSPBGA
Stock5,680
hot XC3S50-4PQG208C
Xilinx Inc.

IC FPGA 124 I/O 208 QFP

  • Number of LABs/CLBs: 192
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 73728
  • Number of I/O: 124
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
Package: 208-BFQFP
Stock12,636
hot XC3S1200E-4FTG256C
Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

  • Number of LABs/CLBs: 2168
  • Number of Logic Elements/Cells: 19512
  • Total RAM Bits: 516096
  • Number of I/O: 190
  • Number of Gates: 1200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock11,952
hot XC3S700A-4FTG256I
Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

  • Number of LABs/CLBs: 1472
  • Number of Logic Elements/Cells: 13248
  • Total RAM Bits: 368640
  • Number of I/O: 161
  • Number of Gates: 700000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock7,680
XCR3256XL-10FTG256C
Xilinx Inc.

IC CPLD 256MC 9NS 256BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
Package: 256-LBGA
Stock6,240
XC95144XL-10CS144I
Xilinx Inc.

IC CPLD 144MC 10NS 144CSBGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 144
  • Number of Gates: 3200
  • Number of I/O: 117
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
Package: 144-TFBGA, CSPBGA
Stock7,008