RECOM has added 3W SMD components in the RA3 series to its low cost range. They are designed to provide optimal voltage for semiconductor open and close drivers. Variants offer single 8V, 9V, or dual +7/-1V, +15/-3V, and +20/-5V outputs. These values include essential igBT, silicon MOSFEts and the latest silicon carbide MOSFEts and GaN HEMT batteries.
Each component has 5.2kV/1 minute functional isolation, and is UL/IEC/EN 62368-1, CAN/CSA-C22.2 No 62368-1 certification, in accordance with EN 61203-3 standard. EMI EN 55032 'A' class does not require additional filtering, 'B' class only requires A simple LC filter. At high frequency switching, 3W is suitable for large IGBt and other Si, SiC and gan devices.
The input voltage is +5V, +12V, +24V, allowing ±10%, and the efficiency is generally above 80%. The isolation capacitance is less than 10pF, and the high immunity of the fast and high voltage switch edge in the high side driver is mainly using the wide band gap technology of SiC and GaN. Operating temperature range -40C to +85C without derating (80C for 1V, 8V and 9V output components).
The series uses "pad grid" terminals for surface mount, measuring only 23.4 mm x 15 mm x 8.5 mm, with a 35% reduction in occupying area and a 60% reduction in volume compared to competing products. The surface mount form with wide spacing provides the desired high degree of isolation between the DC-DC output pin and the rest of the circuit on the customer's PCB, connected only to the top layer.
The enclosed format and wide temperature range of the RA3 series are ideal for harsh environments such as induction heating, telecommunications, renewable energy, solar inverters, EV battery chargers and motor drives.
RECOM Product Manager Matthew Dauterive commented, "We work closely with leading wideband gap device manufacturers to ensure that these DC-dcs deliver the best performance for their latest generation of products. They are also significantly smaller and require fewer external components than other solutions on the market, making them easier to design."
