Quick and easy development application suite for automotive and industrial applications | Heisener Electronics
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Quick and easy development application suite for automotive and industrial applications

Technology Cover
Post Date: 2022-02-18, Rose Enclosures

     RS Components offers a new range of evaluation and development kits for Infineon's AURIX family of microcontrollers, which are based on Infineon's 32-bit TriCore microprocessor core.

     The AURIX TriCore concept incorporates the core elements of a RISC processor, SCM and DSP in a single SCM chip, including embedded security features, which makes electronics designers a good choice for systems developed for a wide variety of automotive and industrial applications.

    To simplify development, the AURIX platform provides a highly IDE environment that gives engineers everything they need to compile, debug, and Flash program their AURIX MCU based applications. Arduino-compatible low-cost evaluation and development kits range from simple design projects to more complex designs.

    For example, the AURIX TC297 TFT Application Suite provides a low-cost, flexible application development platform for the 32-bit AURIX TriCore platform. The kit comes with a variety of on-board components with specific features, integrating the TC297 controller in a 292-pin LFBGA package, a 320 × 240 LCD display, SD card slot, high-speed CAN transceiver and acoustic pager.

     TC275 "Shield Buddy" and TC375 Small Kit Low cost kits follow the Arduino standard, making them compatible with many widely used application shields. In addition, at the high end of the product portfolio, the series offers full-featured kits for automotive and industrial use cases, such as motor control units or automotive gateways. At the lower end, the range includes TC275 "Lite" and TC375 Lite kits, both supported by a free IDE (AURIX Development Studio).

    The product portfolio provides engineers with a wide range of options, including a wide range of memory, frequency, peripherals, temperature and packaging options.

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