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Toshiba - Automotive ultra-low MOSFETs improve thermal performance

Technology Cover
Post Date: 2018-10-09, Toshiba Semiconductor and Storage

Toshiba Electronics Europe launched their TPWR7940PB and TPW1R104PB, 40V N-channel power MOSFETs using DSOP Advance (WF) packages with double-sided cooling capability. The TPWR7940PB is a 40V max 0.79mOhm MOSFET in DSOP Advance(WF)L package, and the TPW1R104PB is a 40V max 1.14mOhm MOSFET in DSOP Advance(WF)M package. Both devices are based upon the latest trench structure U-MOSIX-H process and are AEC-Q101 qualified. They are aimed at automotive applications including electric power steering, load switches and electric pumps.

Both devices are 5mm x 6mm packages with eight pins. The devices differ in their exposed surface area of the top metal plate. The top area is about 8mm2 in DSOP Advance(WF)M and about 12mm2 in DSOP Advance (WF)L. Measured in the company’s test environment, the maximum channel-to-top-plate thermal impedance is 1.5K/W for the TPW1R104PB and 0.93K/W for TPWR7940PB. Their exceptional thermal performance is realised by attaching the top exposed area to a heatsink via an insulating layer.

The packages are footprint-compatible with an SOP Advance (WF) package that hasn’t any exposed top metal area. The packages use a wettable flank terminal structure that allows AOI of solder joints on PCBs. AOI is particularly important in automotive applications where verification of soldering quality is demanded.

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