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74LCXP16245MTD

74LCXP16245MTD

74LCXP16245MTD

For Reference Only

Part Number 74LCXP16245MTD
Manufacturer ON Semiconductor
Description IC TXRX NON-INVERT 3.6V 48TSSOP
Datasheet 74LCXP16245MTD Datasheet
Package 48-TFSOP (0.240", 6.10mm Width)
In Stock 308 piece(s)
Unit Price $ 1.18 *
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74LCXP16245MTD

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74LCXP16245MTD Specifications

ManufacturerON Semiconductor
CategoryIntegrated Circuits (ICs) - Logic - Buffers, Drivers, Receivers, Transceivers
Datasheet 74LCXP16245MTD Datasheet
Package48-TFSOP (0.240", 6.10mm Width)
Series74LCXP
Logic TypeTransceiver, Non-Inverting
Number of Elements2
Number of Bits per Element8
Output Type3-State
Current - Output High, Low24mA, 24mA
Voltage - Supply2 V ~ 3.6 V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package48-TSSOP

74LCXP16245MTD Datasheet

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To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. Is Now Part of ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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© 2005 Fairchild Semiconductor Corporation DS500053 www.fairchildsemi.com August 1998 Revised June 2005 7 4 L C X P 1 6 2 4 5 L o w V o lta g e 1 6 -B it B id ire c tio n a l T ra n s c e iv e r w ith 5 V T o le ra n t In p u ts /O u tp u ts a n d P u ll-D o w n R e s is to rs 74LCXP16245 Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs/Outputs and Pull-Down Resistors General Description The LCXP16245 contains sixteen non-inverting bidirec- tional buffers with 3-STATE outputs and is intended for bus oriented applications. The device is designed for low volt- age (2.5V or 3.3V) VCC applications with capability of inter- facing to a 5V signal environment. The device is byte controlled. Each byte has separate control inputs which could be shorted together for full 16-bit operation. The T/R inputs determine the direction of data flow through the device. The OE inputs disable both the A and B ports by placing them in a high impedance state. In addition, A and B port datapath pins have built-in resis- tors to GND allowing the pins to float without any increase in ICC current. This feature is intended to address modular and space constrained applications where additional space consumed by external resistors is not available. The LCXP16245 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ing CMOS low power dissipation. Features ■5V tolerant inputs and outputs ■2.3V–3.6V VCC specifications provided ■ I/O pull-down resistors terminate inactive busses ensur- ing a stable bus state ■5.5 ns tPD max (VCC 3.3V), 20 PA ICC max ■Power down high impedance inputs and outputs ■Supports live insertion/withdrawal (Note 1) ■r24 mA output drive (VCC 3.0V) ■Pinout compatible with 74 series 16245 ■Latch-up performance exceeds 500 mA ■ESD performance: Human body model ! 2000V Machine model ! 200V Note 1: To ensure the high-impedance state during power up or down OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol Pin Descriptions Order Number Package Number Package Description 74LCXP16245MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LCXP16245MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Pin Names Description OEn Output Enable Input T/Rn Transmit/Receive Input A0–A15 Side A Inputs or 3-STATE Outputs B0–B15 Side B Inputs or 3-STATE Outputs ■ Implements proprietary noise/EMI reduction circuitry

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www.fairchildsemi.com 2 7 4 L C X P 1 6 2 4 5 Connection Diagram Truth Tables H HIGH Voltage Level L LOW Voltage Level X Immaterial Z High Impedance Note 2: A and B port inputs are still active. Functional Descriptions The LCXP16245 contains sixteen non-inverting bidirec- tional buffers with 3-STATE outputs. the device is byte con- trolled. Each byte has separate control inputs which can be shorted together for full 16-bit operation. The T/R inputs determine the direction of data flow through the device. The OE inputs disable both the A and B ports by placing them in a high impedance state. The pulldown resistor (30K: normal) to GND is active only when the outputs are 3-STATED (OE HIGH). When the outputs become active (OE LOW) the resistor is removed from the circuit. Logic Diagram Inputs Outputs OE1 T/R1 L L Bus B0–B7 Data to Bus A0–A7 L H Bus A0–A7 Data to Bus B0–B7 H X HIGH Z State on A0–A7, B0–B7 (Note 2) Inputs Outputs OE2 T/R2 L L Bus B8–B15 Data to Bus A8–A15 L H Bus A8–A15 Data to Bus B8–B15 H X HIGH Z State on A8–A15, B8–B15 (Note 2)

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3 www.fairchildsemi.com 7 4 L C X P 1 6 2 4 5 Absolute Maximum Ratings(Note 3) Recommended Operating Conditions Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom- mended Operating Conditions” table will define the conditions for actual device operation. Note 4: IO Absolute Maximum Rating must be observed. DC Electrical Characteristics Symbol Parameter Value Conditions Units VCC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to 7.0 V VO DC Output Voltage 0.5 to 7.0 Output in 3-STATE V 0.5 to VCC  0.5 Output in HIGH or LOW State (Note 4) IIK DC Input Diode Current 50 VI  GND mA IOK DC Output Diode Current 50 VO  GND mA 50 VO ! VCC IO DC Output Source/Sink Current r50 mA ICC DC Supply Current per Supply Pin r100 mA IGND DC Ground Current per Ground Pin r100 mA TSTG Storage Temperature 65 to 150 qC Symbol Parameter Min Max Units VCC Supply Voltage Operating 2.0 3.6 V Data Retention 1.5 3.6 VI Input Voltage 0 5.5 V VO Output Voltage HIGH or LOW State 0 VCC V 3-STATE 0 5.5 IOH/IOL Output Current VCC 3.0V  3.6V r24 mA VCC 2.7V  3.0V r12 VCC 2.3V  2.7V r8 TA Free-Air Operating Temperature 40 85 qC 't/'V Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V 0 10 ns/V Symbol Parameter Conditions VCC TA 40qC to 85qC Units (V) Min Max VIH HIGH Level Input Voltage 2.3  2.7 1.7 V 2.7  3.6 2.0 VIL LOW Level Input Voltage 2.3  2.7 0.7 V 2.7  3.6 0.8 VOH HIGH Level Output Voltage IOH 100 PA 2.3  3.6 VCC  0.2 V IOH 8 mA 2.3 1.8 IOH 12 mA 2.7 2.2 IOH 18 mA 3.0 2.4 IOH 24 mA 3.0 2.2 VOL LOW Level Output Voltage IOL 100 PA 2.3  3.6 0.2 V IOL 8 mA 2.3 0.6 IOL 12 mA 2.7 0.4 IOL 16 mA 3.0 0.4 IOL 24 mA 3.0 0.55 II Input Leakage Current 0 d VI d 5.5V 2.3  3.6 r5.0 PA IOZ(L) 3-STATE I/O Leakage VI or VO 0.0V 2.3  3.6 r5.0 PA IOZ(H) 3-STATE I/O Leakage VI or VO 5.5V 2.3  3.6 50 500 PA IOFF Power-Off Leakage Current VI or VO 5.5V 0 10 PA ICC Quiescent Supply Current VI V CC or GND 2.3  3.6 20 PA 3.6V d V I, VO d 5.5V (Note 5) 2.3  3.6 r20

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www.fairchildsemi.com 4 7 4 L C X P 1 6 2 4 5 DC Electrical Characteristics (Continued) Note 5: Outputs disabled or 3-STATE only. AC Electrical Characteristics Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design. Dynamic Switching Characteristics Capacitance Symbol Parameter Conditions VCC TA 40qC to 85qC Units (V) Min Max 'ICC Increase in ICC per Input VIH V CC 0.6V 2.3  3.6 500 PA Symbol Parameter TA 40qC to 85qC, RL 500: Units VCC 3.3V r 0.3V VCC 2.7V VCC 2.5V r 0.2V CL 50 pF CL 50 pF CL 50 pF Min Max Min Max Min Max tPHL Propagation Delay 1.5 5.5 1.5 6.0 1.5 6.6 ns tPLH An to Bn or Bn to An 1.5 5.5 1.5 6.0 1.5 6.6 tPZL Output Enable Time 1.5 7.0 1.5 8.0 1.5 9.1 ns tPZH 1.5 7.0 1.5 8.0 1.5 9.1 tPLZ Output Disable Time 1.5 7.0 1.5 7.5 1.5 8.4 ns tPHZ 1.5 7.0 1.5 7.5 1.5 8.4 tOSHL Output to Output Skew (Note 6) 1.0 ns tOSLH 1.0 Symbol Parameter Conditions VCC TA 25qC Units (V) Typical VOLP Quiet Output Dynamic Peak VOL CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 V CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 VOLV Quiet Output Dynamic Valley VOL CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 V CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 Symbol Parameter Conditions Typical Units CIN Input Capacitance VCC Open, VI 0V or VCC 7 pF CI/O Input/Output Capacitance VCC 3.3V, VI 0V or VCC 8 pF CPD Power Dissipation Capacitance VCC 3.3V, VI 0V or VCC, f 10 MHz 20 pF

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5 www.fairchildsemi.com 7 4 L C X P 1 6 2 4 5 AC LOADING and WAVEFORMS Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Waveform for Inverting and Non-Inverting Functions Propagation Delay. Pulse Width and trec Waveforms 3-STATE Output Low Enable and Disable Times for Logic 3-STATE Output High Enable and Disable Times for Logic Setup Time, Hold Time and Recovery Time for Logic trise and tfall FIGURE 2. Waveforms (Input Characteristics; f = 1MHz, tr = tf = 3ns) Test Switch tPLH, tPHL Open tPZL, tPLZ 6V at VCC 3.3 r 0.3V VCC x 2 at VCC 2.5 r 0.2V tPZH, tPHZ GND Symbol VCC 3.3V r 0.3V 2.7V 2.5V r 0.2V Vmi 1.5V 1.5V VCC/2 Vmo 1.5V 1.5V VCC/2 Vx VOL  0.3V VOL  0.3V VOL  0.15V Vy VOH  0.3V VOH  0.3V VOH  0.15V

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www.fairchildsemi.com 6 7 4 L C X P 1 6 2 4 5 Schematic Diagram Generic for LCX Family

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7 www.fairchildsemi.com 7 4 L C X P 1 6 2 4 5 Physical Dimensions inches (millimeters) unless otherwise noted 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS48A

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www.fairchildsemi.com 8 7 4 L C X P 1 6 2 4 5 L o w V o lt a g e 1 6 -B it B id ir e c ti o n a l T ra n s c e iv e r w it h 5 V T o le ra n t In p u ts /O u tp u ts a n d P u ll -D o w n R e s is to rs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea- sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com

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