| Part Number | ECB130ABDCN-Y3 |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Description | LPDDR2 1G DIE 32MX32 |
| Datasheet | |
| Package | - |
| ECAD |
|
| In Stock | 4,496 piece(s) |
| Unit Price | Request a Quote |
| Lead Time | To be Confirmed |
| Estimated Delivery Time | May 3 - May 8 (Choose Expedited Shipping) |
| Request for Quotation |
|
| Payment Methods | |
| Delivery Services |
Part Number # ECB130ABDCN-Y3 (Memory) is manufactured by Micron Technology Inc. and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.
For ECB130ABDCN-Y3 specifications/configurations, quotation, lead time, payment terms of further enquiries please have no hesitation to contact us. To process your RFQ, please add ECB130ABDCN-Y3 with quantity into BOM. Heisener.com does NOT require any registration to request a quote of ECB130ABDCN-Y3.
| Manufacturer | Micron Technology Inc. |
| Category | Integrated Circuits (ICs) - Memory |
| Package | - |
| ECAD |
|
| Series | * |
| Memory Type | - |
| Memory Format | - |
| Technology | - |
| Memory Size | - |
| Memory Interface | - |
| Clock Frequency | - |
| Write Cycle Time - Word, Page | - |
| Access Time | - |
| Voltage - Supply | - |
| Operating Temperature | - |
| Mounting Type | - |
| Package / Case | - |
| Supplier Device Package | - |
Giova*****elton
April 1, 2023
Judi*****amos
March 25, 2023
Catal*****rawford
March 24, 2023
Khlo*****dhwa
March 20, 2023
Ryl*****Sathe
March 16, 2023
Huds*****erez
March 16, 2023
Col*****Meka
March 3, 2023
Davi*****axena
February 27, 2023
Eme***** Nori
February 20, 2023
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We guarantee 100% customer satisfaction.
Our experienced sales team and tech support team back our services to satisfy all our customers.
We provide 90 days warranty.
If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
| Part Number | Manufacturer | Description | Stock |
ECB130ABDCN-Y3 D# V36:1790_07218794 |
Micron Technology Inc |
LPDDR2 32MX32 DIE-COM 1.2V RoHS: Compliant
|
0 |
| Part Number | Manufacturer | Description | Stock |
ECB130ABDCN-Y3 D# ECB130ABDCN-Y3 |
Micron Technology Inc |
LPDDR2 1G DIE 32MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB130ABDCN-Y3) RoHS: Compliant
|
0 |
| Part Number | Manufacturer | Description | Stock |
ECB130ABDCN-Y3 D# ECB130ABDCN-Y3-ND |
Micron Technology Inc |
LPDDR2 1G DIE 32MX32 |
0 |
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