Contact Us
SalesDept@heisener.com 0755-83210559 ext. 805

MAX31730AUB+T

MAX31730AUB+T

MAX31730AUB+T

For Reference Only

Part Number MAX31730AUB+T
Manufacturer Maxim Integrated
Description IC REMOTE TEMP SENSOR USSOP
Datasheet MAX31730AUB+T Datasheet
Package 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
In Stock 461 piece(s)
Unit Price $ 0.7834 *
Lead Time To be Confirmed
Estimated Delivery Time Sep 27 - Oct 2 (Choose Expedited Shipping)
Request for Quotation

Part Number # MAX31730AUB+T (Interface - Specialized) is manufactured by Maxim Integrated and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

For MAX31730AUB+T specifications/configurations, quotation, lead time, payment terms of further enquiries please have no hesitation to contact us. To process your RFQ, please add MAX31730AUB+T with quantity into BOM. Heisener.com does NOT require any registration to request a quote of MAX31730AUB+T.

MAX31730AUB+T Specifications

ManufacturerMaxim Integrated
CategoryIntegrated Circuits (ICs) - Interface - Specialized
Datasheet MAX31730AUB+TDatasheet
Package10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Series-
ApplicationsASIC, CPU, FPGA Die Temp Monitoring
Interface2-Wire
Voltage - Supply3 V ~ 3.6 V
Package / Case10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Supplier Device Package10-uMAX
Mounting TypeSurface Mount

MAX31730AUB+T Datasheet

Page 1

Page 2

General Description The MAX31730 temperature sensor monitors its own tem- perature and the temperatures of three external diode- connected transistors. The operating supply voltage is from 3.0V to 3.6V. Resistance cancellation compensates for high series resistance in circuit-board traces and the external thermal diode, while beta compensation corrects for temperature-measurement errors due to low-beta sensing transistors. All temperature channels have programmable temperature thresholds. When the measured temperature of a channel crosses the respective threshold, a status bit is set in the thermal status registers and the open-drain THERM output asserts. A highest temperature register allows the master to obtain the temperature of the hottest channel. The 2-wire serial interface accepts SMBus protocols (write byte, read byte, send byte, and receive byte) for reading the temperature data and programming the temperature thresholds. Any one of eight available slave addresses can be selected using the address selection input (ADD), which can be connected to ground or con- nected to a grounded resistor. The MAX31730 supports 3.0V to 3.6V operation and is specified for a -40°C to +125°C operating temperature range. It is available in a 10-pin µMAX® and a 12-pin, 3mm x 3mm TDFN package. Benefits and Features ● Highest Temperature Register Simplifies and Speeds Overtemperature Notification ● Accurate Temperature Measurement Helps Designers Meet Error Budgets • 12-Bit, 0.0625°C Resolution • ±1°C Remote Temperature-Measurement Accuracy (0°C to +100°C) • -64°C to +150°C Remote Temperature-Measurement Range • Resistance Cancellation for Remote Channels • Compensation for Low Beta Transistors • Programmable Temperature Thresholds ● Integration Reduces Cost, Board Area, Power-Supply Current, and Slave Address Usage • One Local and Three Remote Temperature-Sensing Channels • Eight Selectable Slave Addresses ● Flexible SMBus/I2C Bus Interfaces to a Variety of Microcontrollers For related parts and recommended products to use with this part, refer to www.maximintegrated.com/MAX31730.related. µMAX is a registered trademark of Maxim Integrated Products, Inc. Ordering Information appears at end of data sheet. VDD DXP1 DXN TO MASTER DXP2 DXP3 IC1 +3.3V +3.3V SDA ADD THERM GND SCL MAX31730 (10 µMAX) IC2 VDD DXP1 DXN1 TO MASTER DXP2 DXN2 DXP3 DXN3 IC1 +3.3V +3.3V SDA ADD THERM GND SCL IC2 MAX31730 (12 TDFN) MAX31730 3-Channel Remote Temperature Sensor 19-6953; Rev 2; 4/15 Typical Application Circuits EVALUATION KIT AVAILABLE

Page 3

VDD, SCL, SDA, THERM, ADD ............................-0.3V to +3.7V All Other Pins ........................................... -0.3V to (VDD + 0.3V) ESD Protection (All Pins, Human Body Model) ....................2kV Continuous Power Dissipation (TA = +70°C) µMAX (derate at 8.8mW/°C above +70°C) ............707.30mW TDFN (derate 24.4mW/°C above +70°C) ...............1951.2mW Operating Temperature Range ......................... -40°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range ............................ -65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C µMAX Junction-to-Ambient Thermal Resistance (θJA) .....113.1°C/W Junction-to-Case Thermal Resistance (θJC) ...............36°C/W TDFN Junction-to-Ambient Thermal Resistance (θJA) ..........41°C/W Junction-to-Case Thermal Resistance (θJC) ..............8.5°C/W (TA = -40°C to +125°C, unless otherwise noted.) (Note 2) (3.0V ≤ VDD ≤ 3.6V, TA = -40°C to +125°C, unless otherwise noted) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Voltage Supply VDD (Note 3) 3.0 3.3 3.6 V Input Logic 0 VIL SDA, SCL (Note 3) -0.3 +0.8 V Input Logic 1 VIH SDA, SCL (Note 3) 2.2 VDD + 0.3 V CEXT (between DXP and DXN) β compensation disabled 2200 pF β compensation enabled 200 pF PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Current IDD Standby (Note 4) 2.5 7 µA Operating, β compensation disabled 700 1200 Temperature Resolution -0.0625 +0.0625 °C Remote Temperature Accuracy TA = 0°C to +70°C, TRJ = 0°C to +100°C -1 +1 °CTA = 0°C to +70°C,TRJ = +100°C to +150°C -2 +2 TA = -40°C to +125°C, TRJ = -40°C to +125°C -2.5 +2.5 MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 2 Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1)Package Thermal Characteristics Recommended Operating Conditions Electrical Characteristics

Page 4

(3.0V ≤ VDD ≤ 3.6V, TA = -40°C to +125°C, timing referenced to VIL(MAX) and VIH(MAX), unless otherwise noted) (Note 6) (Figures 2 and 3) (3.0V ≤ VDD ≤ 3.6V, TA = -40°C to +125°C, unless otherwise noted) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Local Temperature Accuracy TA = 0°C to +70°C -1 +1 °CTA = -20°C to +85°C -1.5 +1.5 TA = -40°C to +125°C -2 +2 Temperature Hysteresis Comparator mode only 2 °C Conversion Time Per Channel β compensation disabled 100 ms β compensation enabled 150 ms Conversion Time for All channels β compensation disabled 350 ms Remote-Diode Source Current IRJ High level 180 µA Low level 12 DXN_ Bias Voltage Beta compensation disabled 0.3 V Beta compensation enabled 0.65 POR Threshold VPOR VDD rising edge 2.65 2.8 V POR Threshold Hysteresis 110 mV THERM Output Low Voltage VOL ISINK = 1mA 100 mV ISINK = 6mA 300 Input Leakage Current ILEAK (Note 5) 0.01 1 µA Output High Leakage Current THERM, SDA 1 µA PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Serial-Clock Frequency fCLK 400 kHz Bus Free Time Between STOP and START Condition tBUF fCLK = 400kHz 1.3 µs Repeated START Condition Setup Time tSU:STA 0.6 µs START Condition Setup Time 90% of SCL to 90% of SDA, fCLK = 400kHz 0.6 µs START Condition Hold Time tHD:STA 90% of SDA to 90% of SCL, fCLK = 400kHz 0.6 µs STOP Condition Setup Time tSU:STO 90% of SCL to 90% of SDA, fCLK = 400kHz 0.6 µs MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 3 I2C AC Electrical Characteristics Electrical Characteristics (continued)

Page 5

Note 2: Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization. Typical values are not guaranteed. Note 3: All voltages referenced to ground. Note 4: SDA = SCL = VDD. Note 5: Applies to pins SDA, SCL, and ADD. Note 6: All timing specifications guaranteed by design. Note 7: A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s falling edge. Note 8: Holding the SDA line low for a time greater than tTIMEOUT causes the device to reset SDA to the idle state of the serial-bus communication (SDA set high). (3.0V ≤ VDD ≤ 3.6V, TA = -40°C to +125°C, timing referenced to VIL(MAX) and VIH(MAX), unless otherwise noted) (Note 6) (Figures 2 and 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Clock Low Period tLOW 10% to 10% 1 µs Clock High Period tHIGH 90% to 90% 1 µs Data-In Hold Time tHD:DAT (Note 7) 0.3 µs Data-In Setup Time tSU:DAT 100 ns Receive Clock/Data Rise Time tR 300 ns Receive Clock/Data Fall Time tF 300 ns Pulse Width of Spike Suppressed tSP 0 50 ns Bus Timeout tTIMEOUT (Note 8) 25 45 ms MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 4 I2C AC Electrical Characteristics (continued)

Page 6

(3.0V ≤ VDD ≤ 3.6V, TA = +25°C, unless otherwise noted.) 400 500 600 700 800 900 1000 -40 10 60 110 AC TI VE C UR RE NT (µ A) TEMPERATURE (°C) VDD = 3.6V ACTIVE CURRENT vs TEMPERATURE toc01 BETA COMPENSATION DISABLED VDD = 3.3V VDD = 3.0V 0 1 2 3 4 5 6 -40 10 60 110 ST AN DB Y CU RR EN T (µ A) TEMPERATURE (°C) VDD = 3.6V STANDBY CURRENT vs TEMPERATURE toc03 VDD = 3.3V VDD = 3.0V 400 600 800 1000 1200 1400 1600 1800 -40 10 60 110 AC TI VE C UR RE NT (µ A) TEMPERATURE (°C) VDD = 3.6V ACTIVE CURRENT vs TEMPERATURE toc02 VDD = 3.3V BETA COMPENSATION ENABLED; BETA = 0.1 VDD = 3.0V -0.25 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 -40 10 60 110 TE MP ER AT UR E ER RO R (°C ) TEMPERATURE (°C) INTERNAL TEMPERATURE ERROR vs. TEMPERATURE toc04 VDD = 3.6V VDD = 3.3V VDD = 3.0V DATA TAKEN IN BATH LIMITED TO +90°C MAX31730 3-Channel Remote Temperature Sensor Maxim Integrated │ 5www.maximintegrated.com Typical Operating Characteristics

Page 7

10 2 3 4 5 9 8 7 6 SDA ADD THERM GNDDXP3 DXP2 DXN DXP1 µMAX TOP VIEW + MAX31730 1 SCLVDD V D D DX P1 DX N1 DX P2 DX N2 DX P3 SC L SD A AD D GN D DX N3 TH ER M MA31730 TOP VIEW 1 + 3 42 TDFN 3mm x 3mm 5 6 11 9 8 71012 PIN NAME FUNCTION µMAX TDFN 1 1 VDD Supply Voltage Input. Bypass to GND with a 0.1µF capacitor. 2 2 DXP1 Combined Current Source and ADC Positive Input for Channel 1 Remote Diode. Connect DXP1 to the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP1 unconnected or connect to DXN or DXN1 if the channel 1 remote diode is not used. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP1 and DXN or DXN1 for noise filtering. — 3 DXN1 Cathode Input for Channel 1 Remote Diode. Connect the cathode of the channel 1 remote-diode-connected transistor to DXN1. If the channel 1 remote transistor is a substrate PNP (e.g., on a CPU or ASIC die), connect the base of the PNP to DXN1. Leave DXN1 unconnected or connect to DXP1 if a remote diode is not used. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP1 and DXN1 for noise filtering. 3 — DXN Shared Cathode Input for Remote-Diode Channels. Connect the cathodes of the channel remote-diode-connected transistors to DXN. If a remote transistor is a substrate PNP (e.g., on a CPU or ASIC die), connect the base of the PNP to DXN. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP_ and DXN for noise filtering. MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 6 Pin Description Pin Configurations

Page 8

PIN NAME FUNCTION µMAX TDFN 4 4 DXP2 Combined Current Source and ADC Positive Input for Channel 2 Remote Diode. Connect DXP2 to the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP2 unconnected or connect to DXN or DXN2 if a remote diode is not used. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP2 and DXN or DXN2 for noise filtering. — 5 DXN2 Cathode Input for Channel 2 Remote Diode. Connect the cathode of the channel 2 remote-diode-connected transistor to DXN2. If the channel 2 remote transistor is a substrate PNP (e.g., on a CPU die), connect the base of the PNP to DXN2. Leave DXN2 unconnected or connect to DXP2 if a remote diode is not used. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP2 and DXN2 for noise filtering. 5 6 DXP3 Combined Current Source and ADC Positive Input for Channel 3 Remote Diode. Connect DXP3 to the anode of a remote-diode-connected, temperature-sensing transistor. Leave DXP3 unconnected or connect to DXN or DXN3 if a remote diode is not used. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP3 and DXN or DXN3 for noise filtering. — 7 DXN3 Cathode Input for Channel 3 Remote Diode. Connect the cathode of the channel 3 remote-diode-connected transistor to DXN3. If the channel 3 remote transistor is a substrate PNP (e.g., on a CPU die), connect the base of the PNP to DXN3. Leave DXN3 unconnected or connect to DXP3 if a remote diode is not used. Connect a capacitor (see the CEXT specification in the Electrical Characteristic table) between DXP3 and DXN3 for noise filtering. 6 8 GND Ground 7 9 THERM Active-Low, Open-Drain Over/Undertemperature Output. Can also be used as a SMBus alert output by setting the device to interrupt mode using the Configuration register. When enabled, THERM asserts low when the temperature of any channel goes beyond a programmed threshold. 8 10 ADD Address-Select Input. Sampled at power-up. One of eight possible addresses can be selected by connecting ADD to GND, or connecting ADD to a grounded resistor. 9 11 SDA I2C/SMBus Serial-Data Input/Output. Connect SDA to a pullup resistor. 10 12 SCL I2C/SMBus Serial-Clock Input. Connect SCL to a pullup resistor. MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 7 Pin Description (continued)

Page 9

Detailed Description The MAX31730 is a precision temperature monitor that features one local and three remote temperature-sensing channels, with programmable temperature thresholds for each channel. Communication with the device is achieved through the SMBus/I2C-compatible serial interface and over/undertemperature-detection output (THERM). The THERM output asserts if the software-programmed tem- perature thresholds are exceeded. THERM normally operates in comparator mode and can be connected to a fan, system shutdown, or other thermal-management circuitry. It can also operate in interrupt mode to serve as a SMBus alert interrupt. ADC Conversion Sequence The device starts the conversion sequence by measuring the temperature on remote channel 1, followed by remote channel 2, remote channel 3, and the local channel. The conversion result for each enabled channel is stored in the corresponding temperature data register. No conver- sion is performed on any remote channel that does not have a diode connected, whose DXP_ - DXN_ inputs are shorted together, or that has a short between DXP_ and VDD, DXP_ and GND, or DXN_ and VDD, or if the chan- nel is not enabled in the Highest Temperature Enable register. See the Register 36h: Diode Fault Status section for additional details. VDD SCL SDA ADD GND MUX REF SMBus/I2C INTERFACE ADC + - CURRENT SOURCE REGISTER BANK CONFIGURATION BYTES REMOTE TEMPERATURES LOCAL TEMPERATURES THERM SMBus ALERT THRESHOLD LOCAL TEMPERATURE THERMAL THRESHOLDS ALERT RESPONSE ADDRESS ALARMMAX31730 DXN1 DXP1 DXN2 DXP2 DXN3 DXP3 MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 8 Block Diagram

Page 10

Series-Resistance Cancellation Some thermal diodes on high-power ICs have excessive series resistance that can cause temperature-measure- ment errors when used with conventional remote temper- ature sensors. External channels 1–3 of the device have a series-resistance cancellation feature that eliminates the effect of diode series resistance and interconnection resistance. The cancellation range is from 0 to 300Ω. Series-resistance cancellation is always enabled. Low-Power Standby Mode Enter software-standby mode by setting the STOP bit to 1 in the Configuration register. Software-standby mode disables the ADC and reduces the supply current to approximately 2.5µA. During software standby, data is retained in memory and the bus interface is active and listening for commands. If a START condition is recognized, activity on the bus causes the supply current to increase. If a standby command is received while a conversion is in progress, the conversion cycle is finished, then the device enters shutdown, and the temperature registers are updated. SMBus Digital Interface The device is SMBus 2.0 compatible and supports four standard SMBus protocols: write byte, read byte, send byte, and receive byte, as well as multibyte reads and writes (Figure 1). The shorter receive-byte protocol allows quicker transfers, provided that the correct register was previously selected by a read-byte instruction. Use caution with the shorter protocols in multimaster systems, since a second master could overwrite the register byte without informing the first master. Figure 2 is the SMBus write timing diagram and Figure 3 is the SMBus read timing diagram. The write-byte format consists of the master transmitting the slave address, followed by the address for the target register, followed by the 8 bits of data to be written to the target register. To write multiple bytes to two or more contiguous registers, write a new byte after each ACK. The register address then increments after each byte is written. End the transaction with a STOP condition. The read-byte format consists of the master transmitting the slave address followed by the address for the register to be read. The master then begins a new transaction by sending the slave address again, after which the slave returns the data from the selected register. To read multiple bytes from two or more contiguous registers, continue reading after each ACK. The register address then increments after each byte is read. Conclude the overall transaction with a NACK and a STOP condition. When the first byte of a 2-byte temperature value is read, the device prevents updates of the second byte’s contents until the second byte has been read. If the second byte has not been read within a SMBus timeout period (nominally 35ms), it is again allowed to update. The send-byte format can be used to transmit a regis- ter address without a transfer of data. It consists of the master transmitting the slave address followed by the address of the target register. The receive-byte format can be used to read data from a register that was previously selected. It consists of the master transmitting the slave address, after which the slave returns the data from the register that was previous- ly selected. After this command completes, the address pointer does not increment. MAX31730 3-Channel Remote Temperature Sensor www.maximintegrated.com Maxim Integrated │ 9

MAX31730AUB+T Reviews

Average User Rating
5 / 5 (93)
★ ★ ★ ★ ★
5 ★
84
4 ★
9
3 ★
0
2 ★
0
1 ★
0

Write a Review

Not Rated
Thanks for Your Review!

Mac*****ells

August 6, 2020

Can't speak to the long term reliability as of yet, but they seem to be of decent quality and I don't expect any issues.

Kay***** Mall

August 3, 2020

Good and works well. What else is there to say about it.

Cal***** Wolf

August 1, 2020

Used these for a solar project, and they are working great.

Sami*****arron

July 30, 2020

The helper is super handy, especially if you work with medium size PCB boards as it allows to hold the board steady in every position. It feels pretty sturdy and of good quality.

Mar***** Sims

July 29, 2020

These are high quality connectors. They work as you would expect them to. There is not much else you can say about them.

Anton*****mmings

July 23, 2020

Perfectly functioning!! on time and as described!

Abb*****inton

July 21, 2020

All items individually packed in anti static bags and properly labeled.

Ayl***** Dada

July 13, 2020

Have never had a problem with my order. Packages arrive on time and in great condition.

Albe*****adhwa

July 9, 2020

I love your products are well organized. You make it easy to spend $$$! Lol. Keep up the good work folks!

Kade*****Borde

July 6, 2020

Item works as described, fast delivery, nice contact!

MAX31730AUB+T Guarantees

Service Guarantee

Service Guarantees

We guarantee 100% customer satisfaction.

Our experienced sales team and tech support team back our services to satisfy all our customers.

Quality Guarantee

Quality Guarantees

We provide 90 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.

MAX31730AUB+T Packaging

Verify Products
Customized Labels
Professional Packaging
Sealing
Packing
Insepction

MAX31730AUB+T Related Products

C0603C360F5GACTU C0603C360F5GACTU KEMET, CAP CER 36PF 50V NP0 0603, 0603 (1608 Metric), - View
C1206C105M8VACTU C1206C105M8VACTU KEMET, CAP CER 1UF 10V Y5V 1206, 1206 (3216 Metric), - View
BZX84J-B11,115 BZX84J-B11,115 Nexperia USA Inc., DIODE ZENER 11V 550MW SOD323F, SC-90, SOD-323F, - View
IXDD609SI IXDD609SI IXYS Integrated Circuits Division, IC GATE DVR 9A NON-INV 8-SOIC, 8-SOIC (0.154", 3.90mm Width) Exposed Pad, - View
LTC4065EDC-4.4#TRPBF LTC4065EDC-4.4#TRPBF Linear Technology, IC CHARGER BATT LI-ON 6-DFN, 6-WFDFN Exposed Pad, - View
MC74VHC1G50DFT1 MC74VHC1G50DFT1 ON Semiconductor, IC BUFFER CMOS NON-INV SOT353, 5-TSSOP, SC-70-5, SOT-353, - View
LTC2057HMS8#TRPBF LTC2057HMS8#TRPBF Linear Technology, IC OPAMP ZERO-DRIFT 1.5MHZ 8MSOP, 8-TSSOP, 8-MSOP (0.118", 3.00mm Width), - View
M55342E05B1C00RWS M55342E05B1C00RWS Vishay Dale, RES SMD 1M OHM 0.1% 0.225W 2208, 2208, - View
PHP00805E1600BBT1 PHP00805E1600BBT1 Vishay Thin Film, RES SMD 160 OHM 0.1% 5/8W 0805, 0805 (2012 Metric), - View
EL3H7(EB)-G EL3H7(EB)-G Everlight Electronics Co Ltd, OPTOISOLATOR 3.75KV TRANS 4-SSOP, 4-SOIC (0.173", 4.40mm), - View
146483-5 146483-5 TE Connectivity AMP Connectors, 10 MODII HDR DRST UNSHRD STKG, -, - View
PLA1G221E02 PLA1G221E02 ITT Cannon, LLC, CIRCULAR, -, - View
Payment Methods
Delivery Services

Quick Inquiry

MAX31730AUB+T

Certified Quality

Heisener's commitment to quality has shaped our processes for sourcing, testing, shipping, and every step in between. This foundation underlies each component we sell.

ISO9001:2015, ICAS, IAF, UKAS

View the Certificates

Do you have any question about MAX31730AUB+T?

0755-83210559 ext. 805 SalesDept@heisener.com heisener007 3008774228 Send Message

MAX31730AUB+T Tags

  • MAX31730AUB+T
  • MAX31730AUB+T PDF
  • MAX31730AUB+T datasheet
  • MAX31730AUB+T specification
  • MAX31730AUB+T image
  • Maxim Integrated
  • Maxim Integrated MAX31730AUB+T
  • buy MAX31730AUB+T
  • MAX31730AUB+T price
  • MAX31730AUB+T distributor
  • MAX31730AUB+T supplier
  • MAX31730AUB+T wholesales

MAX31730AUB+T is Available in