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EP1K30FI256-2

hot EP1K30FI256-2

EP1K30FI256-2

For Reference Only

Part Number EP1K30FI256-2
Manufacturer Intel
Description IC FPGA 171 I/O 256FBGA
Datasheet EP1K30FI256-2 Datasheet
Package 256-BGA
In Stock 417
Quota Limit No Limit
Lead Time Can Ship Immediately
Estimated Delivery Time Aug 27 - Sep 1 (Choose Expedited Shipping)

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EP1K30FI256-2

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EP1K30FI256-2 Specifications

ManufacturerIntel
CategoryIntegrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Datasheet EP1K30FI256-2 Datasheet
Package256-BGA
SeriesACEX-1K®
Number of LABs/CLBs216
Number of Logic Elements/Cells1728
Total RAM Bits24576
Number of I/O171
Number of Gates119000
Voltage - Supply2.375 V ~ 2.625 V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
Package / Case256-BGA
Supplier Device Package256-FBGA (17x17)

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hotEP1K30FI256-2 EP1K30TI144-2NGA Intel, IC FPGA, Package:144-LQFP, Series:ACEX-1K® , Number of LABs/CLBs:216, Number of Logic Elements/Cells:1728, Total RAM Bits:24576, Number of I/O:171, Number of Gates:119000, Voltage - Supply:2.375 V ~ 2.625 V, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:256-BGA, Supplier Device Package:256-FBGA (17x17)
hotEP1K30FI256-2 EP1K100FC484-1N Intel, IC FPGA 333 I/O 484FBGA, Package:484-BBGA, Series:ACEX-1K® , Number of LABs/CLBs:216, Number of Logic Elements/Cells:1728, Total RAM Bits:24576, Number of I/O:171, Number of Gates:119000, Voltage - Supply:2.375 V ~ 2.625 V, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:256-BGA, Supplier Device Package:256-FBGA (17x17)
hotEP1K30FI256-2 EP1K100FC484-2N Intel, IC FPGA 333 I/O 484FBGA, Package:484-BBGA, Series:ACEX-1K® , Number of LABs/CLBs:216, Number of Logic Elements/Cells:1728, Total RAM Bits:24576, Number of I/O:171, Number of Gates:119000, Voltage - Supply:2.375 V ~ 2.625 V, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:256-BGA, Supplier Device Package:256-FBGA (17x17)
hotEP1K30FI256-2 EP1K50QC208-1N Intel, IC FPGA 147 I/O 208QFP, Package:208-BFQFP, Series:ACEX-1K® , Number of LABs/CLBs:216, Number of Logic Elements/Cells:1728, Total RAM Bits:24576, Number of I/O:171, Number of Gates:119000, Voltage - Supply:2.375 V ~ 2.625 V, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:256-BGA, Supplier Device Package:256-FBGA (17x17)
hotEP1K30FI256-2 EP1K50FC484-3 Intel, IC FPGA 249 I/O 484FBGA, Package:484-BBGA, Series:ACEX-1K® , Number of LABs/CLBs:216, Number of Logic Elements/Cells:1728, Total RAM Bits:24576, Number of I/O:171, Number of Gates:119000, Voltage - Supply:2.375 V ~ 2.625 V, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:256-BGA, Supplier Device Package:256-FBGA (17x17)
hotEP1K30FI256-2 EP1K10TC144-2N Intel, IC FPGA 92 I/O 144TQFP, Package:144-LQFP, Series:ACEX-1K® , Number of LABs/CLBs:216, Number of Logic Elements/Cells:1728, Total RAM Bits:24576, Number of I/O:171, Number of Gates:119000, Voltage - Supply:2.375 V ~ 2.625 V, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:256-BGA, Supplier Device Package:256-FBGA (17x17)

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