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MK20DN128VFT5

hotMK20DN128VFT5

MK20DN128VFT5

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Part Number MK20DN128VFT5
Manufacturer NXP
Description IC MCU 32BIT 128KB FLASH 48QFN
Datasheet MK20DN128VFT5 Datasheet
Package 48-VFQFN Exposed Pad
In Stock 283 piece(s)
Unit Price $ 5.6400 *
Lead Time Can Ship Immediately
Estimated Delivery Time Oct 28 - Nov 2 (Choose Expedited Shipping)
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Part Number # MK20DN128VFT5 (Embedded - Microcontrollers) is manufactured by NXP and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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MK20DN128VFT5 Specifications

ManufacturerNXP
CategoryIntegrated Circuits (ICs) - Embedded - Microcontrollers
Datasheet MK20DN128VFT5Datasheet
Package48-VFQFN Exposed Pad
SeriesKinetis K20
Core ProcessorARM? Cortex?-M4
Core Size32-Bit
Speed50MHz
ConnectivityI2C, IrDA, SPI, UART/USART, USB, USB OTG
PeripheralsDMA, I2S, LVD, POR, PWM, WDT
Number of I/O29
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size16K x 8
Voltage - Supply (Vcc/Vdd)1.71 V ~ 3.6 V
Data ConvertersA/D 11x16b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Mounting Type-
Package / Case48-VFQFN Exposed Pad
Supplier Device Package48-QFN-EP (7x7)

MK20DN128VFT5 Datasheet

Page 1

Page 2

K20P48M50SF0 K20 Sub-Family Supports the following: MK20DN32VLF5, MK20DX32VLF5, MK20DN64VLF5, MK20DX64VLF5, MK20DN128VLF5, MK20DX128VLF5, MK20DN32VFT5, MK20DX32VFT5, MK20DN64VFT5, MK20DX64VFT5, MK20DN128VFT5, MK20DX128VFT5 Features • Operating Characteristics – Voltage range: 1.71 to 3.6 V – Flash write voltage range: 1.71 to 3.6 V – Temperature range (ambient): -40 to 105°C • Performance – Up to 50 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz • Memories and memory interfaces – Up to 128 KB program flash. – Up to 32 KB FlexNVM on FlexMemory devices – 2 KB FlexRAM on FlexMemory devices – Up to 16 KB RAM – Serial programming interface (EzPort) • Clocks – 3 to 32 MHz crystal oscillator – 32 kHz crystal oscillator – Multi-purpose clock generator • System peripherals – Multiple low-power modes to provide power optimization based on application requirements – 4-channel DMA controller, supporting up to 41 request sources – External watchdog monitor – Software watchdog – Low-leakage wakeup unit • Security and integrity modules – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip • Analog modules – 16-bit SAR ADC – Two analog comparators (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference • Timers – Programmable delay block – Eight-channel motor control/general purpose/PWM timer – Two-channel quadrature decoder/general purpose timer – Periodic interrupt timers – 16-bit low-power timer – Carrier modulator transmitter – Real-time clock • Communication interfaces – USB full-/low-speed On-the-Go controller with on- chip transceiver – SPI module – I2C module – Three UART modules – I2S module Freescale Semiconductor Document Number: K20P48M50SF0 Data Sheet: Technical Data Rev. 4 5/2012 Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2011–2012 Freescale Semiconductor, Inc.

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Table of Contents 1 Ordering parts...........................................................................3 1.1 Determining valid orderable parts......................................3 2 Part identification......................................................................3 2.1 Description.........................................................................3 2.2 Format...............................................................................3 2.3 Fields.................................................................................3 2.4 Example............................................................................4 3 Terminology and guidelines......................................................4 3.1 Definition: Operating requirement......................................4 3.2 Definition: Operating behavior...........................................5 3.3 Definition: Attribute............................................................5 3.4 Definition: Rating...............................................................6 3.5 Result of exceeding a rating..............................................6 3.6 Relationship between ratings and operating requirements......................................................................6 3.7 Guidelines for ratings and operating requirements............7 3.8 Definition: Typical value.....................................................7 3.9 Typical value conditions....................................................8 4 Ratings......................................................................................9 4.1 Thermal handling ratings...................................................9 4.2 Moisture handling ratings..................................................9 4.3 ESD handling ratings.........................................................9 4.4 Voltage and current operating ratings...............................9 5 General.....................................................................................10 5.1 AC electrical characteristics..............................................10 5.2 Nonswitching electrical specifications...............................11 5.2.1 Voltage and current operating requirements.........11 5.2.2 LVD and POR operating requirements.................11 5.2.3 Voltage and current operating behaviors..............12 5.2.4 Power mode transition operating behaviors..........13 5.2.5 Power consumption operating behaviors..............14 5.2.6 EMC radiated emissions operating behaviors.......18 5.2.7 Designing with radiated emissions in mind...........19 5.2.8 Capacitance attributes..........................................19 5.3 Switching specifications.....................................................19 5.3.1 Device clock specifications...................................19 5.3.2 General switching specifications...........................20 5.4 Thermal specifications.......................................................21 5.4.1 Thermal operating requirements...........................21 5.4.2 Thermal attributes.................................................21 6 Peripheral operating requirements and behaviors....................22 6.1 Core modules....................................................................22 6.1.1 JTAG electricals....................................................22 6.2 System modules................................................................25 6.3 Clock modules...................................................................25 6.3.1 MCG specifications...............................................25 6.3.2 Oscillator electrical specifications.........................27 6.3.3 32 kHz Oscillator Electrical Characteristics...........29 6.4 Memories and memory interfaces.....................................30 6.4.1 Flash electrical specifications................................30 6.4.2 EzPort Switching Specifications............................34 6.5 Security and integrity modules..........................................35 6.6 Analog...............................................................................35 6.6.1 ADC electrical specifications.................................35 6.6.2 CMP and 6-bit DAC electrical specifications.........40 6.6.3 Voltage reference electrical specifications............43 6.7 Timers................................................................................44 6.8 Communication interfaces.................................................44 6.8.1 USB electrical specifications.................................44 6.8.2 USB DCD electrical specifications........................45 6.8.3 USB VREG electrical specifications......................45 6.8.4 DSPI switching specifications (limited voltage range)....................................................................46 6.8.5 DSPI switching specifications (full voltage range).47 6.8.6 I2C switching specifications..................................49 6.8.7 UART switching specifications..............................49 6.8.8 I2S/SAI Switching Specifications..........................49 6.9 Human-machine interfaces (HMI)......................................54 6.9.1 TSI electrical specifications...................................54 7 Dimensions...............................................................................55 7.1 Obtaining package dimensions.........................................55 8 Pinout........................................................................................56 8.1 K20 Signal Multiplexing and Pin Assignments..................56 8.2 K20 Pinouts.......................................................................58 9 Revision History........................................................................58 K20 Sub-Family Data Sheet, Rev. 4 5/2012. 2 Freescale Semiconductor, Inc.

Page 4

1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.freescale.com and perform a part number search for the following device numbers: PK20 and MK20 . 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## A M FFF R T PP CC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values Q Qualification status • M = Fully qualified, general market flow • P = Prequalification K## Kinetis family • K20 A Key attribute • D = Cortex-M4 w/ DSP • F = Cortex-M4 w/ DSP and FPU M Flash memory type • N = Program flash only • X = Program flash and FlexMemory Table continues on the next page... Ordering parts K20 Sub-Family Data Sheet, Rev. 4 5/2012. Freescale Semiconductor, Inc. 3

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Field Description Values FFF Program flash memory size • 32 = 32 KB • 64 = 64 KB • 128 = 128 KB • 256 = 256 KB • 512 = 512 KB • 1M0 = 1 MB R Silicon revision • Z = Initial • (Blank) = Main • A = Revision after main T Temperature range (°C) • V = –40 to 105 • C = –40 to 85 PP Package identifier • FM = 32 QFN (5 mm x 5 mm) • FT = 48 QFN (7 mm x 7 mm) • LF = 48 LQFP (7 mm x 7 mm) • LH = 64 LQFP (10 mm x 10 mm) • MP = 64 MAPBGA (5 mm x 5 mm) • LK = 80 LQFP (12 mm x 12 mm) • MB = 81 MAPBGA (8 mm x 8 mm) • LL = 100 LQFP (14 mm x 14 mm) • ML = 104 MAPBGA (8 mm x 8 mm) • MC = 121 MAPBGA (8 mm x 8 mm) • LQ = 144 LQFP (20 mm x 20 mm) • MD = 144 MAPBGA (13 mm x 13 mm) • MJ = 256 MAPBGA (17 mm x 17 mm) CC Maximum CPU frequency (MHz) • 5 = 50 MHz • 7 = 72 MHz • 10 = 100 MHz • 12 = 120 MHz • 15 = 150 MHz N Packaging type • R = Tape and reel • (Blank) = Trays 2.4 Example This is an example part number: MK20DN32VLF5 3 Terminology and guidelines Terminology and guidelines K20 Sub-Family Data Sheet, Rev. 4 5/2012. 4 Freescale Semiconductor, Inc.

Page 6

3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. 3.1.1 Example This is an example of an operating requirement, which you must meet for the accompanying operating behaviors to be guaranteed: Symbol Description Min. Max. Unit VDD 1.0 V core supply voltage 0.9 1.1 V 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior, which is guaranteed if you meet the accompanying operating requirements: Symbol Description Min. Max. Unit IWP Digital I/O weak pullup/ pulldown current 10 130 µA 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. Terminology and guidelines K20 Sub-Family Data Sheet, Rev. 4 5/2012. Freescale Semiconductor, Inc. 5

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3.3.1 Example This is an example of an attribute: Symbol Description Min. Max. Unit CIN_D Input capacitance: digital pins — 7 pF 3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: • Operating ratings apply during operation of the chip. • Handling ratings apply when the chip is not powered. 3.4.1 Example This is an example of an operating rating: Symbol Description Min. Max. Unit VDD 1.0 V core supply voltage –0.3 1.2 V 3.5 Result of exceeding a rating 40 30 20 10 0 Measured characteristic Operating rating F ai lu re s in ti m e (p pm ) The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. Terminology and guidelines K20 Sub-Family Data Sheet, Rev. 4 5/2012. 6 Freescale Semiconductor, Inc.

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3.6 Relationship between ratings and operating requirements –∞ - No permanent failure - Correct operation Normal operating rangeFatal range Expected permanent failure Fatal range Expected permanent failure ∞ Op era ting ra ting (m ax. ) Op era ting re qui rem ent (m ax. ) Op era ting re qui rem ent (m in.) Op era ting ra ting (m in.) Operating (power on) Degraded operating range Degraded operating range –∞ No permanent failure Handling rangeFatal range Expected permanent failure Fatal range Expected permanent failure ∞ Ha ndl ing ra ting (m ax. ) Ha ndl ing ra ting (m in.) Handling (power off) - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Possible decreased life - Possible incorrect operation 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: • Never exceed any of the chip’s ratings. • During normal operation, don’t exceed any of the chip’s operating requirements. • If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: • Lies within the range of values specified by the operating behavior • Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. Terminology and guidelines K20 Sub-Family Data Sheet, Rev. 4 5/2012. Freescale Semiconductor, Inc. 7

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3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: Symbol Description Min. Typ. Max. Unit IWP Digital I/O weak pullup/pulldown current 10 70 130 µA 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 0.90 0.95 1.00 1.05 1.10 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 150 °C 105 °C 25 °C –40 °C VDD (V) I (μ A ) D D _S T O P TJ 3.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol Description Value Unit TA Ambient temperature 25 °C VDD 3.3 V supply voltage 3.3 V Terminology and guidelines K20 Sub-Family Data Sheet, Rev. 4 5/2012. 8 Freescale Semiconductor, Inc.

Page 10

4 Ratings 4.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol Description Min. Max. Unit Notes MSL Moisture sensitivity level — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 ILAT Latch-up current at ambient temperature of 105°C -100 +100 mA 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4.4 Voltage and current operating ratings Symbol Description Min. Max. Unit VDD Digital supply voltage –0.3 3.8 V Table continues on the next page... Ratings K20 Sub-Family Data Sheet, Rev. 4 5/2012. Freescale Semiconductor, Inc. 9

MK20DN128VFT5 Reviews

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Ade***** Webb

August 19, 2020

Pleased with this purchase, good, quick service and item exactly as shown.

Keir*****llegas

August 16, 2020

They are components and they work. Wasn’t expecting anything more or anything less.

Phili*****phens

August 9, 2020

EXACTLY what I was looking for -- one piece with a low forward voltage drop to isolate some DC power sources. They work fantastic!

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