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MK51DN512CMC10

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MK51DN512CMC10

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Part Number MK51DN512CMC10
Manufacturer NXP
Description IC MCU 32BIT 512KB FLASH 121BGA
Datasheet MK51DN512CMC10 Datasheet
Package 121-LFBGA
In Stock 224 piece(s)
Unit Price $ 11.3400 *
Lead Time Can Ship Immediately
Estimated Delivery Time Jan 30 - Feb 4 (Choose Expedited Shipping)
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Part Number # MK51DN512CMC10 (Embedded - Microcontrollers) is manufactured by NXP and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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MK51DN512CMC10 Specifications

ManufacturerNXP
CategoryIntegrated Circuits (ICs) - Embedded - Microcontrollers
Datasheet MK51DN512CMC10Datasheet
Package121-LFBGA
SeriesKinetis K50
Core ProcessorARM? Cortex?-M4
Core Size32-Bit
Speed100MHz
ConnectivityI2C, IrDA, SPI, UART/USART, USB, USB OTG
PeripheralsDMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O78
Program Memory Size512KB (512K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size128K x 8
Voltage - Supply (Vcc/Vdd)1.71 V ~ 3.6 V
Data ConvertersA/D 37x16b, D/A 2x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Mounting Type-
Package / Case121-LFBGA
Supplier Device Package121-MAPBGA (8x8)

MK51DN512CMC10 Datasheet

Page 1

Page 2

K51P121M100SF2V2 K51 Sub-Family Supports the following: MK51DX256CMC10, MK51DN512CMC10 Features • Operating Characteristics – Voltage range: 1.71 to 3.6 V – Flash write voltage range: 1.71 to 3.6 V – Temperature range (ambient): -40 to 85°C • Performance – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz • Memories and memory interfaces – Up to 512 KB program flash memory on non- FlexMemory devices – Up to 256 KB program flash memory on FlexMemory devices – Up to 256 KB FlexNVM on FlexMemory devices – 4 KB FlexRAM on FlexMemory devices – Up to 128 KB RAM – Serial programming interface (EzPort) • Clocks – 3 to 32 MHz crystal oscillator – 32 kHz crystal oscillator – Multi-purpose clock generator • System peripherals – Multiple low-power modes to provide power optimization based on application requirements – Memory protection unit with multi-master protection – 16-channel DMA controller, supporting up to 63 request sources – External watchdog monitor – Software watchdog – Low-leakage wakeup unit • Security and integrity modules – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip • Human-machine interface – Segment LCD controller supporting up to 40 frontplanes and 8 backplanes, or 44 frontplanes and 4 backplanes, depending on the package size – Low-power hardware touch sensor interface (TSI) – General-purpose input/output • Analog modules – Two 16-bit SAR ADCs – Programmable gain amplifier (PGA) (up to x64) integrated into each ADC – Two 12-bit DACs – Two operational amplifiers – Two transimpedance amplifiers – Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference • Timers – Programmable delay block – Eight-channel motor control/general purpose/PWM timer – Two 2-channel quadrature decoder/general purpose timers – Periodic interrupt timers – 16-bit low-power timer – Carrier modulator transmitter – Real-time clock • Communication interfaces – USB full-/low-speed On-the-Go controller with on- chip transceiver – Three SPI modules – Two I2C modules – Six UART modules – Secure Digital host controller (SDHC) – I2S module Freescale Semiconductor Document Number: K51P121M100SF2V2 Data Sheet: Technical Data Rev. 3, 6/2013 Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2012–2013 Freescale Semiconductor, Inc.

Page 3

Table of Contents 1 Ordering parts...........................................................................4 1.1 Determining valid orderable parts......................................4 2 Part identification......................................................................4 2.1 Description.........................................................................4 2.2 Format...............................................................................4 2.3 Fields.................................................................................4 2.4 Example............................................................................5 3 Terminology and guidelines......................................................5 3.1 Definition: Operating requirement......................................5 3.2 Definition: Operating behavior...........................................6 3.3 Definition: Attribute............................................................6 3.4 Definition: Rating...............................................................7 3.5 Result of exceeding a rating..............................................7 3.6 Relationship between ratings and operating requirements......................................................................7 3.7 Guidelines for ratings and operating requirements............8 3.8 Definition: Typical value.....................................................8 3.9 Typical value conditions....................................................9 4 Ratings......................................................................................10 4.1 Thermal handling ratings...................................................10 4.2 Moisture handling ratings..................................................10 4.3 ESD handling ratings.........................................................10 4.4 Voltage and current operating ratings...............................10 5 General.....................................................................................11 5.1 AC electrical characteristics..............................................11 5.2 Nonswitching electrical specifications...............................11 5.2.1 Voltage and current operating requirements.........12 5.2.2 LVD and POR operating requirements.................13 5.2.3 Voltage and current operating behaviors..............13 5.2.4 Power mode transition operating behaviors..........15 5.2.5 Power consumption operating behaviors..............16 5.2.6 EMC radiated emissions operating behaviors.......19 5.2.7 Designing with radiated emissions in mind...........20 5.2.8 Capacitance attributes..........................................20 5.3 Switching specifications.....................................................20 5.3.1 Device clock specifications...................................20 5.3.2 General switching specifications...........................21 5.4 Thermal specifications.......................................................22 5.4.1 Thermal operating requirements...........................22 5.4.2 Thermal attributes.................................................22 6 Peripheral operating requirements and behaviors....................23 6.1 Core modules....................................................................23 6.1.1 Debug trace timing specifications.........................23 6.1.2 JTAG electricals....................................................24 6.2 System modules................................................................27 6.3 Clock modules...................................................................27 6.3.1 MCG specifications...............................................27 6.3.2 Oscillator electrical specifications.........................29 6.3.3 32 kHz oscillator electrical characteristics.............31 6.4 Memories and memory interfaces.....................................32 6.4.1 Flash electrical specifications................................32 6.4.2 EzPort switching specifications.............................37 6.5 Security and integrity modules..........................................38 6.6 Analog...............................................................................38 6.6.1 ADC electrical specifications.................................38 6.6.2 CMP and 6-bit DAC electrical specifications.........45 6.6.3 12-bit DAC electrical characteristics.....................48 6.6.4 Op-amp electrical specifications...........................51 6.6.5 Transimpedance amplifier electrical specifications — full range....................................52 6.6.6 Transimpedance amplifier electrical specifications — limited range..............................53 6.6.7 Voltage reference electrical specifications............54 6.7 Timers................................................................................55 6.8 Communication interfaces.................................................55 6.8.1 USB electrical specifications.................................55 6.8.2 USB DCD electrical specifications........................56 6.8.3 USB VREG electrical specifications......................56 6.8.4 DSPI switching specifications (limited voltage range)....................................................................56 6.8.5 DSPI switching specifications (full voltage range).58 6.8.6 Inter-Integrated Circuit Interface (I2C) timing........60 6.8.7 UART switching specifications..............................61 6.8.8 SDHC specifications.............................................61 6.8.9 I2S/SAI switching specifications............................62 6.9 Human-machine interfaces (HMI)......................................68 6.9.1 TSI electrical specifications...................................68 6.9.2 LCD electrical characteristics................................69 7 Dimensions...............................................................................70 7.1 Obtaining package dimensions.........................................70 K51 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc.

Page 4

8 Pinout........................................................................................71 8.1 K51 signal multiplexing and pin assignments....................71 8.2 K51 pinouts.......................................................................76 9 Revision history.........................................................................77 K51 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 3

Page 5

1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to freescale.com and perform a part number search for the following device numbers: PK51 and MK51. 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## A M FFF R T PP CC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values Q Qualification status • M = Fully qualified, general market flow • P = Prequalification K## Kinetis family • K51 A Key attribute • D = Cortex-M4 w/ DSP • F = Cortex-M4 w/ DSP and FPU M Flash memory type • N = Program flash only • X = Program flash and FlexMemory Table continues on the next page... Ordering parts K51 Sub-Family Data Sheet, Rev. 3, 6/2013. 4 Freescale Semiconductor, Inc.

Page 6

Field Description Values FFF Program flash memory size • 32 = 32 KB • 64 = 64 KB • 128 = 128 KB • 256 = 256 KB • 512 = 512 KB • 1M0 = 1 MB • 2M0 = 2 MB R Silicon revision • Z = Initial • (Blank) = Main • A = Revision after main T Temperature range (°C) • V = –40 to 105 • C = –40 to 85 PP Package identifier • FM = 32 QFN (5 mm x 5 mm) • FT = 48 QFN (7 mm x 7 mm) • LF = 48 LQFP (7 mm x 7 mm) • LH = 64 LQFP (10 mm x 10 mm) • MP = 64 MAPBGA (5 mm x 5 mm) • LK = 80 LQFP (12 mm x 12 mm) • LL = 100 LQFP (14 mm x 14 mm) • MC = 121 MAPBGA (8 mm x 8 mm) • LQ = 144 LQFP (20 mm x 20 mm) • MD = 144 MAPBGA (13 mm x 13 mm) • MJ = 256 MAPBGA (17 mm x 17 mm) CC Maximum CPU frequency (MHz) • 5 = 50 MHz • 7 = 72 MHz • 10 = 100 MHz • 12 = 120 MHz • 15 = 150 MHz N Packaging type • R = Tape and reel • (Blank) = Trays 2.4 Example This is an example part number: MK51DN512ZVMD10 3 Terminology and guidelines 3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. Terminology and guidelines K51 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 5

Page 7

3.1.1 Example This is an example of an operating requirement: Symbol Description Min. Max. Unit VDD 1.0 V core supply voltage 0.9 1.1 V 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior: Symbol Description Min. Max. Unit IWP Digital I/O weak pullup/ pulldown current 10 130 µA 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. 3.3.1 Example This is an example of an attribute: Symbol Description Min. Max. Unit CIN_D Input capacitance: digital pins — 7 pF Terminology and guidelines K51 Sub-Family Data Sheet, Rev. 3, 6/2013. 6 Freescale Semiconductor, Inc.

Page 8

3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: • Operating ratings apply during operation of the chip. • Handling ratings apply when the chip is not powered. 3.4.1 Example This is an example of an operating rating: Symbol Description Min. Max. Unit VDD 1.0 V core supply voltage –0.3 1.2 V 3.5 Result of exceeding a rating 40 30 20 10 0 Measured characteristic Operating rating F ai lu re s in ti m e (p pm ) The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. Terminology and guidelines K51 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 7

Page 9

3.6 Relationship between ratings and operating requirements –∞ - No permanent failure - Correct operation Normal operating rangeFatal range Expected permanent failure Fatal range Expected permanent failure ∞ Op era ting ra ting (m ax. ) Op era ting re qui rem ent (m ax. ) Op era ting re qui rem ent (m in.) Op era ting ra ting (m in.) Operating (power on) Degraded operating range Degraded operating range –∞ No permanent failure Handling rangeFatal range Expected permanent failure Fatal range Expected permanent failure ∞ Ha ndl ing ra ting (m ax. ) Ha ndl ing ra ting (m in.) Handling (power off) - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Possible decreased life - Possible incorrect operation 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: • Never exceed any of the chip’s ratings. • During normal operation, don’t exceed any of the chip’s operating requirements. • If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: • Lies within the range of values specified by the operating behavior • Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. Terminology and guidelines K51 Sub-Family Data Sheet, Rev. 3, 6/2013. 8 Freescale Semiconductor, Inc.

Page 10

3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: Symbol Description Min. Typ. Max. Unit IWP Digital I/O weak pullup/pulldown current 10 70 130 µA 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 0.90 0.95 1.00 1.05 1.10 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 150 °C 105 °C 25 °C –40 °C VDD (V) I (μ A ) D D _S T O P TJ 3.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol Description Value Unit TA Ambient temperature 25 °C VDD 3.3 V supply voltage 3.3 V Terminology and guidelines K51 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 9

MK51DN512CMC10 Reviews

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Dawso*****kerson

December 19, 2020

Purchased this in May and didn't use it until last week. worked and all was good.

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December 18, 2020

I always have good experiences in dealing with Heisener Electronics. They have the components I need in stock, their search function is great, and shipping is fast and always as promised.

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