Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microsemi Solutions Sdn Bhd. |
IC SIGNAL COND 4X4 69-BGA
|
Package: 69-FBGA |
Stock7,888 |
|
TTL/CMOS | 4 | 2.5V, 3.3V | - | 1.5W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
|
|
|
Infineon Technologies |
IC SGL CHIP ADSL-CPE LBGA-256
|
Package: 256-LBGA |
Stock2,000 |
|
ADSL, JTAG, SPI | 1 | - | - | - | - | Surface Mount | 256-LBGA | PG-LBGA-256 |
|
|
Exar Corporation |
IC LIU E1 7CH 3.3V 100TQFP
|
Package: 100-LQFP |
Stock15,312 |
|
LIU | 7 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 75°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
|
|
|
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 324BGA
|
Package: 324-BGA |
Stock3,280 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock5,824 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
|
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 4CH 225BG
|
Package: 225-BGA |
Stock4,496 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
|
|
|
Exar Corporation |
IC LIU T1/E1/J1 OCTAL 225BGA
|
Package: 225-BGA |
Stock6,576 |
|
LIU | 8 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
|
|
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256BGA
|
Package: 256-LBGA, CSBGA |
Stock5,392 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
|
|
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock7,520 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
IXYS Integrated Circuits Division |
IC MOD PH-LINE 1.07X1.07X0.4"PCB
|
Package: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Stock2,880 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
|
|
Maxim Integrated |
IC TXRX T1 1-CHIP 5V LP 44-PLCC
|
Package: 44-LCC (J-Lead) |
Stock3,792 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA
|
Package: 420-LBGA Exposed Pad |
Stock4,720 |
|
LIU | 12 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA Exposed Pad | 420-TBGA (35x35) |
|
|
|
Maxim Integrated |
IC LIU E1/T1/J1 QUAD 144BGA
|
Package: 144-BGA |
Stock7,696 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
|
|
|
NXP |
IC C2K 900MHZ 16CH VOIP 625BGA
|
Package: - |
Stock4,992 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microsemi Corporation |
IC VOICE LINE VCPNG 72CH 128TQFP
|
Package: 128-TQFP |
Stock112,128 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
|
|
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Package: 80-LQFP |
Stock1,387,524 |
|
PCM | 2 | 4.75 V ~ 35 V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
|
|
|
Microsemi Corporation |
IC VOICEPORT 1CH FXS 4KHZ 44LQFP
|
Package: 44-LQFP |
Stock167,556 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
|
|
|
Maxim Integrated |
IC TXRX E1 3.3V 100-LQFP
|
Package: 100-LQFP |
Stock10,452 |
|
E1, HDLC | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
|
|
Texas Instruments |
IC TONE DECODER CMOS 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock112,980 |
|
- | 1 | 2 V ~ 9 V | - | 500mW | -25°C ~ 100°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
Package: - |
Stock5,792 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microsemi Corporation |
MODULE SONET/SDH
|
Package: - |
Stock7,936 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
Package: - |
Stock5,328 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microsemi Corporation |
2CH 120V ABS MISLIC PCM, 53QFN
|
Package: - |
Stock4,016 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC ETHERNET SWITCH 672BGA
|
Package: - |
Stock7,212 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
|
|
Microchip Technology |
IC CODEC MFC 5V 20SSOP
|
Package: 20-SSOP (0.209", 5.30mm Width) |
Stock6,480 |
|
SSI | 1 | 4.75V ~ 5.25V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
|
|
|
Microchip Technology |
IC TDM/TSI SWITCH 256X256 48SSOP
|
Package: 48-BSSOP (0.295", 7.50mm Width) |
Stock2,480 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
|
|
|
Microchip Technology |
TEMAP 84FDL GREEN DUAL PASSIVATI
|
Package: - |
Stock3,696 |
|
E1, T1 | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC ECHO CANCELLER DUAL 28PLCC
|
Package: 28-LCC (J-Lead) |
Stock4,608 |
|
Serial | 2 | 4.5V ~ 5.5V | 70mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
|
|
|
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Package: 80-LQFP |
Stock4,960 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
|
|
|
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Package: 80-LQFP |
Stock7,584 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
