Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LIU E1/T1/J1 160BGA
|
Package: 160-LBGA |
Stock2,384 |
|
E1, HDLC, J1, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 160-LBGA | P-LBGA-160 |
||
Infineon Technologies |
IC LINE CARD CTRLR HDLC TQFP-100
|
Package: 100-LQFP |
Stock7,728 |
|
ISDN | - | 3.13 V ~ 3.47 V | 272.6mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | P-TQFP-100 |
||
NXP |
IC C1K 650MHZ VOIP 448BGA
|
Package: - |
Stock4,128 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC TDM SWITCH 512CH 144LBGA
|
Package: 144-LBGA |
Stock3,472 |
|
- | 1 | 3 V ~ 3.6 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 48SSOP
|
Package: 48-SSOP (0.295", 7.50mm Width) |
Stock7,788 |
|
- | 1 | 3 V ~ 3.6 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 48-SSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
Package: 144-BGA, CSPBGA |
Stock5,600 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
Package: 217-BBGA |
Stock9,768 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Silicon Labs |
IC PROSLIC/CODEC DUAL 64TQFP
|
Package: 64-TQFP |
Stock6,592 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 160-BGA
|
Package: 160-BGA |
Stock7,472 |
|
Parallel/Serial | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
Package: 256-LBGA Exposed Pad |
Stock7,392 |
|
- | 4 | 3.135 V ~ 3.465 V | - | - | - | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 20SOIC
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock4,624 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC TRANSCEIVER T1 44-PLCC
|
Package: 44-LCC (J-Lead) |
Stock7,776 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microsemi Corporation |
IC TXRX SGL T1/E1 100MQFP
|
Package: 100-BQFP |
Stock5,904 |
|
- | 1 | 4.75 V ~ 5.25 V | 200mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 8I/O 32PLCC
|
Package: 32-LCC (J-Lead) |
Stock3,872 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Broadcom Limited |
ETHERNET SWITCH 10GE
|
Package: - |
Stock2,752 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETH SWITCH 24FE 4X2.5G MULTILAYE
|
Package: - |
Stock7,936 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
Package: - |
Stock5,808 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68-QFN
|
Package: 68-VFQFN Exposed Pad |
Stock8,484 |
|
- | - | - | - | - | - | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microchip Technology |
TQFP48, GREEN, IND, MRLB, NO FLA
|
Package: 48-TQFP |
Stock9,180 |
|
SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
IC SERDED EHTERNET 256BGA
|
Package: - |
Stock6,444 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC CODEC MFC 5V 20SOIC
|
Package: 20-SOIC (0.209", 5.30mm Width) |
Stock4,864 |
|
- | 1 | 4.75V ~ 5.25V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SOIC |
||
Microchip Technology |
IC TXRX DTMF 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock2,064 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microchip Technology |
IC RECEIVER DTMF 18SOIC
|
Package: 18-SOIC (0.295", 7.50mm Width) |
Stock5,120 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC CODEC A-LAW PCM 18DIP
|
Package: 18-DIP (0.300", 7.62mm) |
Stock6,160 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock2,528 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
WSE-40, LF BUMP
|
Package: - |
Stock6,784 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Broadcom Limited |
24XGE + 6X10GE/HG2 L3 SWITCH
|
Package: - |
Stock4,128 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24GE + 4X1G/2.5G SWITCH
|
Package: - |
Stock4,896 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TEMAP 168, LF BUMP
|
Package: - |
Stock4,688 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
2CH PLC CLASS AB LINE DRIVER W R
|
Package: - |
Stock25,824 |
|
- | - | - | - | - | - | - | - | - |