NXP Products

MRF8S23120HR5

NXP

FET RF 65V 2.3GHZ NI-780

• Transistor Type: LDMOS
• Frequency: 2.3GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 800mA
• Power - Output: 28W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

Package: NI-780

MRF6S19200HSR3

NXP

FET RF 66V 1.99GHZ NI780S

• Transistor Type: LDMOS
• Frequency: 1.93GHz ~ 1.99GHz
• Gain: 17.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.6A
• Power - Output: 56W
• Voltage - Rated: 66V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

Package: NI-780S

BF556C,215

NXP

JFET N-CH 30V 18MA SOT23

• Transistor Type: N-Channel JFET
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: 18mA
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 30V
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Package: TO-236-3, SC-59, SOT-23-3

MRF8S21200HSR6

NXP

FET RF 2CH 65V 2.14GHZ NI-1230HS

• Transistor Type: LDMOS (Dual)
• Frequency: 2.14GHz
• Gain: 18.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 48W
• Voltage - Rated: 65V
• Package / Case: NI-1230S
• Supplier Device Package: NI-1230S

Package: NI-1230S

PDTA123ES,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 2.2k
• Resistor - Emitter Base (R2) (Ohms): 2.2k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

BAP50-04,215

NXP

DIODE PIN GP 50V 50MA SOT-23

• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
• Resistance @ If, F: 5 Ohm @ 10mA, 100MHz
• Power Dissipation (Max): 250mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Package: TO-236-3, SC-59, SOT-23-3

MCZ34701EW

NXP

IC PWR SUPPLY 1.5A SW 32-SOIC

• Applications: Controller, Power QUICC? I, II
• Voltage - Input: 2.8 V ~ 6 V
• Number of Outputs: 2
• Voltage - Output: 7.75V, 0.8 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

Package: 32-SOIC (0.295", 7.50mm Width)

PCF85116-3T/01,112

NXP

IC EEPROM 16KBIT 400KHZ 8SO

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (2K x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: -
• Access Time: -
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Package: 8-SOIC (0.154", 3.90mm Width)

HSTL16919DGG,118

NXP

IC MEMORY ADDRESS LATCH 48TSSOP

• Logic Type: D-Type, Addressable
• Circuit: 9:18
• Output Type: Standard
• Voltage - Supply: 3.15 V ~ 3.45 V
• Independent Circuits: 1
• Delay Time - Propagation: 1.9ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

Package: 48-TFSOP (0.240", 6.10mm Width)

74LVC273PW/AUJ

NXP

IC FLIP FLOP OCTAL D 20TSSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 230MHz
• Max Propagation Delay @ V, Max CL: 8.2ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Iq): 10µA
• Input Capacitance: 5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

Package: 20-TSSOP (0.173", 4.40mm Width)

74LVT16646ADL,518

NXP

IC TRANSCVR 16BIT N-INV 56SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

Package: 56-BSSOP (0.295", 7.50mm Width)

TDA8933T/N1,118

NXP

IC AMP AUDIO 32W STER D 32SO

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 32W x 1 @ 16 Ohm; 15.7W x 2 @ 8 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 32-SO
• Package / Case: 32-SOIC (0.295", 7.50mm Width)

Package: 32-SOIC (0.295", 7.50mm Width)

UJA1061TW/5V0/C/T,

NXP

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

• Applications: Automotive Networking
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 27 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

MPC8548ECVTAUJC

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Package: 783-BBGA, FCBGA

KMPC8314CVRAGDA

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

Package: 620-BBGA Exposed Pad

XPC8255ZUIFBC

NXP

IC MPU MPC82XX 200MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

Package: 480-LBGA

MC705B16NBE

NXP

IC MCU 8BIT 15KB OTP 56PSDIP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI
• Peripherals: POR, WDT
• Number of I/O: 32
• Program Memory Size: 15KB (15K x 8)
• Program Memory Type: OTP
• EEPROM Size: 256 x 8
• RAM Size: 352 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 56-SDIP (0.600", 15.24mm)
• Supplier Device Package: 56-PSDIP

Package: 56-SDIP (0.600", 15.24mm)

P89LPC916FDH,129

NXP

IC MCU 8BIT 2KB FLASH 16TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 4x8b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

MC68HRC98JK3ECDW

NXP

IC MCU 8BIT 4KB FLASH 20SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

PC8144TVT1000

NXP

DSP 1GHZ HI-TEMP 783BGA

• Type: SC3400 Core
• Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
• Clock Rate: 1GHz
• Non-Volatile Memory: External
• On-Chip RAM: 10.5MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BFBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Package: 783-BFBGA, FCBGA

TFF11145HN/N1,118

NXP

IC FREQUENCY GENERATOR 24HVQFN

• PLL: Yes
• Main Purpose: Ku band VSAT applications
• Input: Clock
• Output: Clock
• Number of Circuits: 1
• Ratio - Input:Output: 1:4
• Differential - Input:Output: Yes/No
• Frequency - Max: 14.8GHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

Package: 24-VFQFN Exposed Pad

MPXA6115AC7U

NXP

PRESSURE SENSOR ABS AXIAL 8-DIP

• Pressure Type: Absolute
• Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.550", 13.97mm), Top Port
• Supplier Device Package: 8-DIP

Package: 8-DIP (0.550", 13.97mm), Top Port

TEA6846H/V2,518

NXP

IC CAR RADIO TUNER 80-LQFP

• Frequency: AM, FM, WB
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: 78mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 7.8 V ~ 9.2 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

Package: 80-LQFP

13193EVB-A00

NXP

BOARD EVAL FOR MC13192,MC13193

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC13192, MC13193
• Supplied Contents: Board

Package: -

MC35FS4503NAE

NXP

FS4500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

Package: 48-LQFP Exposed Pad

MC33664ATL1EG

NXP

TRANSFORMER PHYSICAL LAYER

• Applications: Isolated Communications Interface
• Current - Supply: 40mA
• Voltage - Supply: 4.5 V ~ 7 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

T4081NSE7NQB

NXP

IC MPU QORIQ T4 1.3GHZ 1932BGA

• Core Processor: PowerPC e6500
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1Gbps (13), 10Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FCPBGA (45x45)

Package: -

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FS32K142WAT0WLHR

NXP

S32K142W ARM CORTEX-M4F, UP TO 8

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 29x12b SAR; D/A 8x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Package: -

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MC9S08PL8SCTJR

NXP

PL16S, 20TSSOP

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LINbus, SCI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 12x10b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Package: -

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MIMX8US5DVK08SC

NXP

I.MX8ULP, SOLO 800MHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

Package: -

Request a Quote