NXP Products

PHB78NQ03LT,118

NXP

MOSFET N-CH 25V 40A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 11nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 970pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 107W (Tc)
• Rds On (Max) @ Id, Vgs: 9 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

BLP8G10S-45PJ

NXP

TRANS LDMOS 45W 4HSOPF

• Transistor Type: LDMOS (Dual)
• Frequency: 952.5MHz ~ 957.5MHz
• Gain: 20.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 224mA
• Power - Output: 2.5W
• Voltage - Rated: 65V
• Package / Case: SOT-1223-1
• Supplier Device Package: 4-HSOPF

Package: SOT-1223-1

BF245A,126

NXP

JFET N-CH 30V 6.5MA TO92

• Transistor Type: N-Channel JFET
• Frequency: 100MHz
• Gain: -
• Voltage - Test: 15V
• Current Rating: 6.5mA
• Noise Figure: 1.5dB
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 30V
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MC34717EP

NXP

IC CONVERTER DDR 26QFN

• Applications: Converter, DDR
• Voltage - Input: 3 V ~ 6 V
• Number of Outputs: 2
• Voltage - Output: 0.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 26-VFQFN Exposed Pad
• Supplier Device Package: 26-QFN-EP (5x5)

Package: 26-VFQFN Exposed Pad

BUK110-50GL,118

NXP

MOSFET N-CH 50V 45A D2PAK

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 45A
• Rds On (Typ): 30 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
• Supplier Device Package: D2PAK

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

PCF8578T/1,118

NXP

IC LCD DRVR ROW/CLMN 56-VSOP

• Display Type: LCD
• Configuration: Dot Matrix
• Interface: I2C
• Digits or Characters: -
• Current - Supply: -
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSOP (0.435", 11.05mm Width)
• Supplier Device Package: 56-VSOP

Package: 56-BSOP (0.435", 11.05mm Width)

NVT2010PW,118

NXP

IC TRANSLATOR BIDIR VOLT 24TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 10
• Voltage - VCCA: 1V ~ 3.6V
• Voltage - VCCB: 1.8V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain, Push-Pull
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

Package: 24-TSSOP (0.173", 4.40mm Width)

NTB0104BQ-Q100X

NXP

IC TXRX TRANSLATING 4B 14DHVQFN

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 4
• Voltage - VCCA: 1.2V ~ 3.6V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 100Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 14-VFQFN Exposed Pad
• Supplier Device Package: 14-DHVQFN (2.5x3)

Package: 14-VFQFN Exposed Pad

74LV123N,112

NXP

IC DUAL RETRIG MULTIVIB 16-DIP

• Logic Type: Monostable
• Independent Circuits: 2
• Schmitt Trigger Input: No
• Propagation Delay: 14ns
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Package: 16-DIP (0.300", 7.62mm)

TDA9884TS/V1,118

NXP

IC IF-PLL I2C-BUS DEMOD 24-SSOP

• Type: Demodulator
• Applications: Mobile Reception
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

TDF8599TH/N2,518

NXP

IC AMP AUDIO PWR 85W D 36HSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 85W x 1 @ 1 Ohm; 70W x 2 @ 2 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 36-HSOP
• Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

PX1012A-EL1/G,551

NXP

IC PCI-EXPRESS X1 PHY 81-LFBGA

• Applications: PCI Express MAX to PCI Express PHY
• Interface: IEEE 1149.1
• Voltage - Supply: 1.2V
• Package / Case: 81-LFBGA
• Supplier Device Package: 81-LFBGA (9x9)
• Mounting Type: Surface Mount

Package: 81-LFBGA

MC33901WEFR2

NXP

IC TXRX PHY WAKEUP/TIMOUT 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

SC18IM700IPW,128

NXP

IC CTRL I2CW/UART 16TSSOP

• Protocol: I2C
• Function: Controller
• Interface: UART
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 9mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

NX3L2267GM,115

NXP

IC ANALOG SWITCH SPDT 10XQFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 90 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 37pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.55x2)

Package: 10-XFQFN

MPC8544ECVTANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Package: 783-BBGA, FCBGA

MCIMX7D7DVM10SC

NXP

EPDC, 2 ETH, CAN, 2 OTG 1 HSIC,

• Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? MPE
• RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, MIPI
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
• Package / Case: 541-LFBGA
• Supplier Device Package: 541-MAPBGA (19x19)

Package: 541-LFBGA

MCF51QM32VHS

NXP

IC MCU 32BIT 32KB FLASH 44MAPLGA

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 2x16b, 11x16b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-VFLGA
• Supplier Device Package: 44-MAPLGA (5x5)

Package: 44-VFLGA

MSC7116VF1000

NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, I2C, UART
• Clock Rate: 266MHz
• Non-Volatile Memory: ROM (8 kB)
• On-Chip RAM: 400kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

Package: 400-LFBGA

PCA85063ATT/AJ

NXP

IC RTCC I2C/ALARM 8TSSOP

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Square Wave Output
• Memory Size: -
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 0.9 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 1.8µA @ 5V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

KTY83/120,113

NXP

IC TEMP SENSOR DO34

• Resistance in Ohms @ 25°C: 1k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 175°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: DO-204AG, DO-34, Axial
• Supplier Device Package: DO-34

Package: DO-204AG, DO-34, Axial

OM5592/MF1S50,699

NXP

DEMO MIFARE 1K 5 TAGS MF1S50

• Type: Mifare 1K
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: 5 Tags

Package: -

UJA1136HW/3V3Y

NXP

IC TRANSCEIVER

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

SP5745CBK1AMMJ6R

NXP

DUAL CORE 2M FLASH 256

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz, 160MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

Package: 256-LBGA

S912XDT384J1VAL

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

S9S12XS256J0VALR

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

P1025NXE5DFB

NXP

IC MPU 533MHZ 561-TEPBGA1

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA I (23x23)

Package: 561-FBGA

MC912D60AVFUE8

NXP

IC MCU 16BIT 60KB FLASH 80QFP

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: CANbus, MI Bus, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: A/D 8x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

Package: 80-QFP

PCA9527DPZ

NXP

IC REDRIVER I2C 1CH 10TSSOP

• Type: Buffer, Accelerator
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 3
• Delay Time: 350ns
• Signal Conditioning: -
• Capacitance - Input: 8 pF
• Voltage - Supply: 2.7V ~ 3.6V, 2.7V ~ 5.5V
• Current - Supply: 100mA
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-TSSOP

Package: -

LPC5502JBD64Y

NXP

IC MCU 32BIT 64KB FLASH 64TQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 96MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 45
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 9x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

Package: -

Request a Quote