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Latest Technologies

Records 1483
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Technology Cover

2019-02-09, TDK - Series of rugged AC filter capacitors extended

TDK Corporation has expanded its EPCOS B32754* to B32758* series of AC filter capacitors.

Technology Cover

2019-02-09, Analog Devices - Demo board provides high efficiency, high-density power management IC development tool (DC2268A-G)

The Analog Devices DC2268A-G Demonstration Board is a high efficiency, high-density power management IC development tool.

Technology Cover

2019-02-09, Texas Instruments - Amplifier EVM highlights digital input closed-loop automotive Class-D audio amplifier (TAS5720A-Q1EVM)

Texas Instruments TAS5720A-Q1EVM Amplifier EVM highlights the TAS5720A-Q1 digital input closed-loop automotive Class-D audio amplifier.

Technology Cover

2019-02-09, ON Semiconductor - CE certification for Sigfox verified RF SiP solution

ON Semiconductor has achieved CE certification for its AX-SIP-SFEU SiP solution, meaning the device conforms to health, safety and environmental protection standards for products sold within the European Economic Area.

Technology Cover

2019-02-09, TDK - Wide range input dual output DC-DC converters have six-sided shielding

TDK Corporation has introduced the TDK-Lambda brand 15W and 30W rated CCG-D dual output DC-DC converters. Similar to the single output CCG15-S and CCG30‑S, the products have the industry standard 1″ x 1″ footprint and can operate over a wide 4:1 input range.

Technology Cover

2019-02-09, Analog Devices - Transceivers combine three-channel isolator and IEC EMC transient protection in single package (ADM2795E)

Analog Devices ADM2795E Transceivers are 5kVrms signal-isolated RS-485 transceivers. The transceivers offer up to ±42V of AC/DC peak bus overvoltage fault protection on the RS-485 bus pins.

Technology Cover

2019-01-16, Microchip - Accelerate development of remote IoT nodes with low-power SiP family (SAM R34/R35)

Microchip has released a highly integrated LoRa SiP family with an ultra-low-power 32-bit MCU, sub-GHz RF LoRa transceiver and software stack.

Technology Cover

2019-01-16, Analog Devices - Industrial automation solutions help accelerate the path to Industry 4.0

Analog Devices has announced a wide range of solutions within its advanced Industry 4.0 roadmap targeted at supporting industrial equipment OEMs to accelerate their path to Industry 4.0.

Technology Cover

2019-01-16, Power Integrations - Motor driver eliminates heatsinks, slashes software certification time and expense

Power Integrations has released its BridgeSwitch integrated half-bridge (IHB) motor driver IC family. BridgeSwitch ICs provide high and low-side advanced FREDFETs with integrated lossless current sensing, ending in inverter conversion efficiency of up to 98.5% in BLDC motor drive applications to 300W.

Technology Cover

2019-01-16, TDK - Ceramic capacitors in modular flex-assembly technology

TDK Corporation has extended the lineup of CeraLink capacitors with CeraLink FA types in modular flex-assembly technology.

Technology Cover

2019-01-16, Texas Instruments - Evaluation module demos function and versatility of dual-channel amplifier (OPA2810DGKEVM)

Texas Instruments OPA2810DGKEVM Evaluation Module demonstrates the functionality and versatility of the dual-channel OPA2810 amplifier in the DGK (VSSOP-8) package.

Technology Cover

2019-01-16, Cypress - Ultra-low-power data-logging solution for portable medical, wearable and IoT devices

Cypress Semiconductor has introduced a nonvolatile data-logging solution with ultra-low power consumption. This solution is perfect for the latest-generation portable medical and wearable devices and other IoT applications that require nonvolatile memories to continuously log a growing amount of user and sensor data while using as little power as possible.

Technology Cover

2019-01-16, Littelfuse - SIP relay provides up to 4000V input-to-output isolation for high-performance switching

Littelfuse has introduced the CPC1984Y, a 600V, Normally Open Power SIP Relay, rated for up to 1A DC/1Arms continuous load current, twice the load current of the company’s most popular power relay from IXYS Integrated Circuits, now part of the company.

Technology Cover

2018-12-18, Cypress - Instrument cluster solution offers enhanced user experience

Cypress Semiconductor has announced that global automotive supplier Yazaki North America has implemented the company’s instrument cluster solution to run the advanced graphics in its instrument cluster for a leading American car manufacturer.

Technology Cover

2018-12-18, RECOM - Evaluation boards for simple testing of DOSA converters

For its recently released RPM and RBB10 series, RECOM has introduced corresponding evaluation boards which provide a shortcut to the otherwise long-winded testing, as these boards provide customers with an effortless way to evaluate these DOSA modules.

Technology Cover

2018-12-18, Texas Instruments - Low-noise operational amplifier for wideband transimpedance and voltage amplifier applications (OPA859)

Texas Instruments OPA859 Wideband Low-Noise Operational Amplifier comes with CMOS inputs for wideband transimpedance and voltage amplifier applications.

Technology Cover

2018-12-18, Analog Devices - Envelope detector offers excellent accuracy with low power consumption (ADL6010)

Analog Devices ADL6010 Envelope Detector is a versatile, broadband envelope detector covering the microwave spectrum.

Technology Cover

2018-12-18, Fujitsu - New satellite navigation module has faster and more accurate positioning

Fujitsu Electronics Europe is expanding its ultra-low power portfolio to incorporate a multi-receiver GNSS module: MSB1054. GNSS now encompasses a mixture of systems: not only GPS but also GLONASS, QZSS, SBAS, Galileo and BeiDou.