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Latest Technologies

Records 1508
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Technology Cover

2019-04-07, Microchip - Ethernet bridges use low-power sub-states enabling power savings

Microchip has released the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are exploring PCIe 3.1 LPSS L1.1 and L1.2 for power savings.

Technology Cover

2019-04-07, Texas Instruments - Low-power op-amp provides high slew rate for battery-powered devices

TLV9052 operational amplifier from Texas Instruments, highlights a high slew rate and low quiescent current, the dual op-amp is perfect for battery-powered motor-drive applications, as well as large appliances, sensor signal conditioners, photodiode amplifiers, and low-side current sensing.

Technology Cover

2019-04-07, Littelfuse - SiC Schottky diodes provide improved efficiency, reliability and thermal management

Littelfuse has introduced two second-generation series of 650V, AEC-Q101-qualified SiC Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are offered with a selection of current ratings (6A, 8A, 10A, 16A or 20A).

Technology Cover

2019-04-07, Hirose - Industrial series I/O connector offers design flexibility for next-generation industrial modules

Hirose has expanded its rugged ix industrial connector family to include a vertical receptacle. The ix80 Series vertical receptacle gives design flexibility for manufacturers of next-generation industrial equipment.

Technology Cover

2019-04-07, Amphenol RF - Quick connect SMA adapter ideal for test and measurement applications

Amphenol RF has released the SMA Quick-Connect adapter, a straight jack to straight plug configuration, as part of a wide portfolio of coaxial adapters.

Technology Cover

2019-04-07, Renesas Electronics - Expanded MCU lineup for high-temperature-tolerant motor control applications

Renesas Electronics Corporation has expanded its RX24T and RX24U Groups of 32-bit MCUs to incorporate new high-temperature-tolerant models for motor-control applications that need an extended operating temperature range.

Technology Cover

2019-04-06, Microchip - Develop low-power wireless sensor nodes with small sub-GHz module

Microchip has released what is claimed to be the industry’s smallest IEEE 802.15.4-compliant module that couples an ultra-low-power MCU with a sub-GHz radio, expediting time to market and offering long-lasting battery life in wireless-networked sensors.

Technology Cover

2019-04-06, Osram - Partnership boosts wireless lighting within smart buildings

OSRAM provides interoperability between the Casambi CBU-DCS module and OSRAM DEXAL driver. Accordingly, the module is registered as an official ‘Works with OSRAM DEXAL’ component.

Technology Cover

2019-04-06, RECOM - Low power DC-DC converters for critical medical designs

RECOM has introduced medical-grade DC-DC modules which provide 3.5W, 5W and 6W. These converters offer all key features demanded for critical medical applications while keeping down the cost of these modular solutions.

Technology Cover

2019-04-06, TE Connectivity - Rugged connector series provides high levels of design flexibility

TE Connectivity has released its HDSCS connector series, a growing product line that provides solutions for applications where sealed, rugged connections are required.

Technology Cover

2019-04-06, Toshiba - New single-supply single-gate logic devices supports low voltage operation

Toshiba Electronics Europe has launched a range of single-supply single-gate logic devices. In total the lineup includes 31 devices that ease the design of voltage-level translation as applied in data communication between devices, such as between microprocessors and peripherals.

Technology Cover

2019-04-06, Texas Instruments - BAW technology shrinks BOM and improves network performance

Texas Instruments offers new BAW-based embedded processing and analog chips for the next generation of connectivity and communications infrastructure.

Technology Cover

2019-04-06, Bourns - New family of P-TCO devices to protect USB-C cables

Bourns has introduced a new family of Polymeric Thermal Cutoff (P-TCO) devices created to protect USB-C cables from destructive and potentially dangerous thermal runaway events.

Technology Cover

2019-04-04, Texas Instruments - Smart high-side switches for 12V automotive system usage

Texas Instruments TPS1HA08-Q1 Smart High-side Switches provide robust protection and diagnostic features designed for use with 12V automotive systems.

Technology Cover

2019-04-04, Diodes Incorporated - Bipolar transistors enable higher power density

The Diodes Incorporated family of NPN and PNP power bipolar transistors supplied in a small form factor (3.3mm x 3.3mm), provide increased power density for applications demanding up to 100V and 3A.

Technology Cover

2019-04-04, ON Semiconductor - Out-of-the-box sensor development kit for power-optimised IoT applications

ON Semiconductor has introduced the RSL10 Sensor Development Kit, designed to give engineering teams a comprehensive platform for creating IoT applications with cutting-edge smart sensor technology, and enabled by what is claimed to be the industry’s lowest power Bluetooth Low Energy radio.

Technology Cover

2019-04-04, Analog Devices - Audio bus and processor technologies improve energy efficiency and infotainment experience

Analog Devices has announced that BYD Co., Ltd has chosen the company’s A2B and SHARC DSP to build more energy efficient and eco-friendly vehicle platforms while improving the immersive audio entertainment encounter for drivers.

Technology Cover

2019-04-04, TDK - Low loss DIN rail redundancy module has load sharing balance indication

TDK Corporation has introduced the DRM40 series of DIN rail mount redundancy modules. Two 10V to 30VDC inputs are each rated at 20A and the output at 40A. A 150% peak load ability for four seconds is offered for capacitive and inductive loading.