Qualcomm Technologies, Inc., announced that the Qualcomm X100 5G RAN Accelerator Card and Qualcomm QRU100 5G RAN Platform are starting to demo to customers and partners worldwide to integrate and validate next-generation 5G mobile infrastructure solutions.
Boreas Technologies has introduced the BOS1921 micro piezoelectric actuator, which provides autonomous operation and sensing capabilities for piezoelectric haptic trackpads in a single chip, unlike other piezoelectric actuators that require dedicated forcy-sensing electronics, bringing savings to PC Oems
Silicon Labs xGM240P radio board is designed to work with the WSTK main board (not included) to support the development of 2.4 GHz wireless IoT devices for protocols including Bluetooth Low Energy (BLE), Bluetooth mesh, Thread, Matter, and Zigbee. The xGM240P module radio board comes in +10 dBm and +20 dB.
Silicon Labs launches a new 2.4 GHz wireless PCB module to provide IoT device manufacturers with a faster and simpler development process. As an expansion product of the BG24 and MG24 series of wireless SoCs, this series of modules can be more flexible to create smarter, more Faster, more energy-efficient applications while protecting end-user privacy
Renesas Electronics Introduces ClockMatrix System Synchronizer, Achieves Class D Compliance for O-RAN S-Plane Requirements, ClockMatrix Device Provides Synchronization and Software Solutions for AMD RFSoC DFE Development Platform and O-RU Reference Design
Teledyne DALSA has introduced AxCIS, a new family of high-speed high-resolution fully integrated line scan imaging modules. The easy-to-use contact Image sensor (CIS) combines sensors, lenses, and lights into one, making it a low-cost detection system suitable for many demanding machine vision applications.
Lifting applications have special requirements for the installation space of the drive device. Nordisk's new MAXXDRIVE XD is an industrial gearbox with a larger center distance, ideal for U-shaped drives, motors and cable reels.
ROHM designed the buck DC-DC converter IC with built-in MOSFET (switching regulator), BD9S402MUF-C, for automotive applications covering infotainment and ADAS, including onboard sensors and cameras that are becoming more advanced.
Microchip Technology Inc has released the PIC32CM JH MCU. This is the industry's first MCU based on the Arm Cortex-M0+ architecture, supporting AUTOSAR, mist and secure boot.
Stmicro's L4985A/B and L4986A/B power factor correction (PFC) boost converters with integrated 800V starting circuits, as well as STMICRO's proprietary practical auxiliary features, help simplify application design and improve design flexibility.
TDK has introduced the new B58101A0109A* (HP100) series heat pump sensors. This NTC (Negative temperature coefficient) sensor is designed to meet the requirements of automotive applications. It can measure the refrigerant temperature in the pipeline indirectly by measuring the temperature of the pipeline surface. The new element is suitable for harsh working conditions
Bourns has introduced a bidirectional power Transient Voltage Suppressor (PTVS) diode designed for high-power DC line protection applications. The new model PTVS20-015C-TH is capable of handling 20 kA surges at a low voltage of 15 V, making it an ideal and effective electrostatic discharge (ESD) protection solution for applications requiring high-power DC bus protection.
Diodes has announced the addition of three new 20Gbps devices rated at 1.8V to its large scale programmable multichannel linear ReDrivers product line. Designed to address the rapidly growing USB4 Gen3, Thunderbolt 4.0, and DisplayPort™ 2.0 standards.
